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Brand :
HYRNUSItem No. :
HY-HW300Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFull-Automatic Heavy Wire Bonder Power Module Wire Bonding Machine
Product Introduction
HY-HW300 Full-Automatic Heavy Wire Bonder is specifically designed for internal pin interconnection processes of chips in the production of special electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing. It is mainly used in power modules for applications such as new energy vehicles and electric bicycles; wind power generation and conversion modules; solar power generation, conversion and storage modules; lithium battery power systems; rail transit systems; medical and aviation power supply modules, as well as automotive components, converters, and other related applications.
Equipment Performance
| No. | Feature |
| 1 | Automatic real-time bonding deformation monitoring, providing direct welding status feedback control |
| 2 | Real-time ultrasonic energy monitoring, providing welding energy feedback control |
| 3 | Supports constant length and constant height loop control capability |
| 4 | Supports non-destructive pull test capability |
| 5 | Easy replacement of front and rear cutting blades |
| 6 | Supports active cutting mode, providing stable and precise control of cutting depth |
| 7 | Supports voice coil wire clamp |
| 8 | Supports automatic force calibration |
| 9 | High-definition bond head maintenance image auxiliary tool |
Technical Specifications
| No. | Parameter | Specification |
| 1. | Bonding Accuracy | ±5 μm @ 3σ |
| 2. | Bonding Force | 50~1500 g |
| 3. | Bonding Area | X: 305 mm, Y: 457 mm, ±220° rotation |
| 4. | Capillary Length | 2.5 inch, 2 inch |
| 5. | Z Travel Range | 50 mm, 0.1 μm resolution |
| 6. | Wire Types | Aluminum wire (100~500 μm), Copper wire (100~300 μm) |
| 7. | Ultrasonic Transducer | Frequency: 60 kHz; Power: 0~60 W, stepped flexible application capability |
| 8. | Bonding Speed | ≥ 1.2 wires/s |
| 9. | Loop Control | Fully programmable |
| 10. | Operating System | Windows 10 |
| 11. | Cavity Depth Range | Max. 35 mm |
| 12. | Equipment Net Weight | Approx. 1200 kg |
Terms of use
| No | Item | Requirements |
| 1. | Footprint (W×D×H) | ≤1000 × 1500 × 1700 mm (excluding monitor space) |
| 2. | Equipment Weight | Approx. 1200 kg |
| 3. | Ambient Temperature | Normal room temperature (20°C ~ 26°C); high temperature operation will affect equipment service life |
| 4. | Compressed Air Requirement | 0.4~0.8 MPa, flow rate >150 L/min (dry treatment, dust removal, oil-water separation) |
| Residual oil content: 0.01 ppm; Filtration: particles >0.01 μm; Low dew point temperature: -20°C | ||
| 5. | Ambient Humidity | ≤60% relative humidity |
| 6. | Ambient Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 7. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 8. | Others | - Ensure power supply is located near the machine |
| - Precision leveling with a leveling instrument is required after installation on site | ||
| - Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination | ||
| - Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination | ||
| 9. | Voltage | AC 220V ± 10% |
| 10. | Frequency | 50/60 Hz |
| 11. | Grounding | Must be grounded |
| 12. | Power | ≥ 1000 W |
| 13. | Interface Specification | 10A, Single-phase 3-wire |
Product Details
HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.
HY-BW830 Wire Bonder is an aluminum wire bonding system designed for power module assembly, primarily used for lead connection between batteries and bus bars, supporting aluminum wire diameters of 125–500 μm.
HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder features a rotary bonding head, automatic digital frequency tracking, precise pressure control, advanced image recognition, and closed-loop motion control.
HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.
HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.
HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.
HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires.
HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.
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