Fully Automatic Wire Bonder Ball Bonding Machine for Sensors, Lasers, Optical Devices

Product Introduction

The HY-WB700/HY-WB700P Fully Automatic Ball Wire Bonder is a high-precision standard planar wire bonding system designed for advanced semiconductor packaging applications. It supports flexible customization of rails, fixtures, and magazine systems to meet diverse customer production requirements. The machine is equipped with a programmable auto-focus optical path and dual optical path configuration, ensuring accurate alignment and stable imaging during bonding operations. Its dual-frequency transducer and high-reliability motion control system provide consistent ultrasonic performance and precise wire bonding quality.

The system features a high-rigidity X-Y table guide rail design and robust workholder structure, significantly improving mechanical stability and long-term operational accuracy. A programmable fully automatic material handling system enhances production efficiency and reduces manual intervention. In addition, the PR Look Ahead function enables faster and smoother pattern recognition and trajectory execution. The multi-channel, multi-stage electronic flame-off (EFO) system ensures reliable wire termination, making the HY-WB700/HY-WB700P suitable for high-volume, high-reliability manufacturing environments.

Features

Technical Specifications

No.	Parameter	Specification
1.	Workholder (Customizable)
2.	Workholder Z Travel	13 mm
3.	Heater Temperature	Room temperature ~ 300°C
4.	Workholder X-Y Range	73 mm × 100 mm
5.	Operating System	Windows
6.	Bonding Travel	60 mm × 90 mm
7.	Min Bond Pad Pitch	45 μm
8.	Bonding Accuracy	±2 μm @ 3σ
9.	Wire Diameter	18 μm ~ 50 μm
10.	Max Wire Length	7 mm
11.	Min Loop Height	60 μm
12.	Loop Height Accuracy	±25.4 μm
13.	Wire Swing	±25 μm
14.	Loop Control	Fully programmable
15.	Optical Path (Optional)	2~4 / 1.6~3.6 continuous zoom, programmable auto focus
16.	Standard Bonding Speed	45 ms/wire cycle time
17.	Auto Focus Distance (Z)	4 mm
18.	Chip Angle Tolerance	Rotation ±45°
19.	Chip Position Tolerance	X: ±190 μm, Y: ±140 μm
20.	Bonding Force	0~360 g
21.	Ultrasonic Power	0~2 W
22.	Compressed Air Requirement	0.35~1 MPa, Φ10 air fitting
23.	Input Voltage	AC 220V ± 10% (50 Hz)
24.	Rated Air Consumption	150 L/min @ 0.5 MPa
25.	Weight	Net: 650 kg
26.	Loop Modes	Q loop / S loop / BGA-Twist
27.	Maximum Dimensions (W×D×H)	1300 × 1000 × 1700 mm