Wafer Processing Equipment

HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.

HY-WT9230 is developed for ultra-hard brittle semiconductor materials up to 12 inches. Built with dual air-bearing spindles and a high-precision grinding Z-axis, it supports fully automatic mirror thinning with high efficiency and damage-free processing. Equipped with a porous vacuum chuck and ultra-fine feed control, the machine ensures superior flatness and thickness uniformity for semiconductor wafer thinning processes.

HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.

HY-SP855 single-side copper polisher handles precision lapping and polishing for semiconductor hard brittle materials. It adopts PLC touch control and built-in disc conditioner, featuring variable frequency drive, closed-loop pressure control and plate water cooling. The conditioned plate flatness reaches 0.01mm, delivering stable, uniform processing for high-precision substrate mass production.

HY-WC615 double-side wafer chamfering machine is equipped with CCD vision positioning & online thickness measurement modules, self-developed core mechanical components and full auto loading/unloading system, delivering outstanding machining precision and user-friendly touch operation for wafer chamfer processing.

HY-SW360 is used for mounting compound semiconductor wafers on ceramic plates prior to thinning. It features precise quantitative solid wax dispensing, independent air cylinder pressing and accurate temperature control, achieving TTV ≤0.005 mm after mounting. Composed of mechanical, pneumatic-water and electrical control subsystems, it delivers stable high-precision wax mounting for wafer thinning processes.

The HY-ST3005 handles 4–12 inch hard brittle semiconductor substrates for high-precision back thinning. Iteratively upgraded for superior accuracy and long-term stability, it features premium core assemblies (hydrostatic air-bearing grinding spindle, high-precision wafer spindle, high-rigidity large-diameter rotary table) and high automation for mass production of silicon and compound semiconductor wafers.

The HY-ST3002 handles 4–12 inch wafers for precision thinning and grinding of hard brittle semiconductors. Fully upgraded with mature processes, it features enhanced accuracy and stable long-run performance, with refined automatic thinning architecture and premium key parts: hydrostatic air-bearing grinding spindle, hydrostatic air-bearing wafer holding spindle, high-rigidity large-diameter rotary table.

The HY-SP910 is equipped with PLC & touchscreen control system for simple setup, easy operation and stable performance. It performs ultra-precise single-sided polishing on thin components, supporting semiconductor substrates (sapphire, SiC, silicon & epitaxial wafers) as well as optical glass wafers, quartz crystals, ceramic wafers, stainless steel workpieces and fiber-optic connectors.