Plasma Surface Treatment

HY-EB03H 2.5L tabletop ICP treatment unit is compact lab plasma surface treatment equipment with 13.56MHz RF power and dual gas channels. It generates high-density ICP plasma for cleaning, activating, etching and bonding materials, and is widely used for PDMS microfluidics, photoresist ashing and semiconductor lab research.  

HY-ES10 is an experimental plasma treatment system, widely adopted by research institutes, universities, corporate R&D labs and low-volume production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a vacuum chamber, plasma generator, vacuum pump, and gas inlet & exhaust ports. The treatment chamber is fabricated from square stainless steel.

HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.

HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.

HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.

HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.

HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.

HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.