die bonding machine

HY-PB300 Fully Automatic Epoxy Die Bonder is designed for multi-chip packaging applications. It integrates precision dispensing, die placement, upper and lower vision positioning, flexible PR recognition and accurate force control, providing stable and efficient assembly for hybrid circuits, COB, MCM, MEMS, RF and optoelectronic modules.

HY-DB300 Fully Automatic Dispensing and Die Bonding Machine is a fully automatic dispensing and die bonding machine designed for high-precision multi-chip and chip-to-wafer assembly. It supports wafers up to 8 inches, chips from 0.2 × 0.2 mm to 15 × 15 mm, wafer mapping, dual-vision positioning and 3D stacking up to 5 mm. The machine achieves ±3 μm placement accuracy and a pick-and-place capacity of up to 1,200 UPH. 

HY-GD4000 handles both eutectic bonding and adhesive die attach for chip packaging. Equipped with dual bond heads and dual eutectic stages, it delivers high productivity with a 12-station automatic nozzle library. The independent ZR axis ensures precise component placement and consistent bonding pressure, while programmable multi-stage heating adapts to various eutectic alloys for multi-chip and flip-chip assembly. Its integrated vision system realizes automatic high-precision positioning and post-bond quality inspection.

HY-GD3000 serves diverse adhesive chip packaging with programmable mounting. It supports in-line loading, 300×200mm fixtures, auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins, and processes up to 12-inch wafers. It features syringe & multi-glue tray dispensing, full closed-loop Z-axis force control (min 10±1g) and flip chip mounting. Dual vision enables visualized, stable & precise microchip packaging.

HY-GD800 is suitable for COB/COC multi-chip packaging processes and supports both dispensing die attach and thermal eutectic bonding. Fitted with a dual-drive gantry structure and high-precision CCD visual positioning system, its bonding head automatically switches between nozzles and dispensing tips to handle all types of chips. It accommodates standard 2-inch & 4-inch die trays, as well as 6-inch & 8-inch wafers with automatic wafer loading and unloading. An optional substrate conveyor track can be connected to external equipment to build automatic production lines. Bonding programs support custom editing to fit all customized production requirements.

HY-EBT505 is a dedicated eutectic device for TO packaging, compatible with TO56, TO9 and TO38 bases, enabling simultaneous eutectic bonding of two components on one single base. Equipped with visual positioning, linear motor manipulator and constant-temperature eutectic stage with nitrogen protection, as well as assembly line loading/unloading and vacuum pick-up detection structure, it delivers high mounting accuracy and stable process, simplifies packaging procedures and improves production efficiency and finished product yield.

HY-MD561P is developed for COB/COC multi-chip packaging. Equipped with linear motor and CCD vision positioning system, three independent pick-and-place heads, it supports auto feeding of 6-inch wafers and 2-inch waffle packs. Built-in through vision correction; optional syringe dispensing and UV curing systems can be configured to realize chip-substrate bonding.

HY-SD8012 Die Attach Equipmentis an advanced soft solder die bonder compatible with 12"–6" wafers, featuring thin chip handling capability with accuracy and speed reaching imported-equipment levels. 

HY-MSD08/SD12 Die Attach Equipment is a one-time bonding solution designed for multi-chip power device products.It can load three wafers (8" & 12") and perform dual-chip (Type A & B) bonding simultaneously.

HY-PD12 Die Bonder is a high-precision panel-level die bonding system specifically designed for FOWLP/PLP advanced packaging processes, widely used in high-performance computing/AI chips, 5G/mmWave RF devices, SiP solutions, and Mini/Micro LED display panels.

HY-LD512H Die Bonding Machine is  Linear Die Bonder a high-performance linear die bonder designed specifically for advanced IC packaging applications. Engineered to meet the rigorous demands of modern semiconductor manufacturing.

HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications.