Semiconductor Equipment Suppiler | Wire Bonder

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Gold Wire Bonder Ball Bonding Machine
HY-GB2012 Gold Ball Wire Bonder is mainly used for internal lead bonding of high-power LEDs, laser diodes, small and medium power diodes, transistors, integrated circuits, sensors, and special semiconductor devices. It is especially suitable for wire bonding of high-power LED devices.
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Ultrasonic Wire Bonding Machine For Laboratory
HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.
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One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Products

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration