Products

HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.

HY-GD3000 serves diverse adhesive chip packaging with programmable mounting. It supports in-line loading, 300×200mm fixtures, auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins, and processes up to 12-inch wafers. It features syringe & multi-glue tray dispensing, full closed-loop Z-axis force control (min 10±1g) and flip chip mounting. Dual vision enables visualized, stable & precise microchip packaging.

HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable bonding performance.

HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-TFS210 Lead Cutting Machine is an automatic trim and form system specifically designed for SMA, SMB, and SMC package products. It features a simple structure with stable and reliable performance, a small footprint, fast and stable operation, low noise, and easy operation and maintenance, significantly reducing labor intensity. 

HY-GD800 is suitable for COB/COC multi-chip packaging processes and supports both dispensing die attach and thermal eutectic bonding. Fitted with a dual-drive gantry structure and high-precision CCD visual positioning system, its bonding head automatically switches between nozzles and dispensing tips to handle all types of chips. It accommodates standard 2-inch & 4-inch die trays, as well as 6-inch & 8-inch wafers with automatic wafer loading and unloading. An optional substrate conveyor track can be connected to external equipment to build automatic production lines. Bonding programs support custom editing to fit all customized production requirements.

HY-TF110 Semiconductor Post Mold Equipment  is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes. 

HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.

HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-EBT505 is a dedicated eutectic device for TO packaging, compatible with TO56, TO9 and TO38 bases, enabling simultaneous eutectic bonding of two components on one single base. Equipped with visual positioning, linear motor manipulator and constant-temperature eutectic stage with nitrogen protection, as well as assembly line loading/unloading and vacuum pick-up detection structure, it delivers high mounting accuracy and stable process, simplifies packaging procedures and improves production efficiency and finished product yield.

HY-TF210 Trim Roll Former is an automatic trim and form system specifically designed for TO252-6R package products. It delivers a throughput of ≥70k per hour with a punching stroke rate of 50–60 strokes per minute, and features MTBA of ≥40 minutes, MTBF of ≥120 hours, MTTA of ≤5 minutes, and downtime rate of ≤3%.

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.