Semiconductor Equipment Suppiler | Wire Bonder

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Ultrasonic Heavy Aluminum Wire Wedge Bonder
HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.
Read More
Optoelectronic Drying Oven for LED Diodes, Digital Tubes
HY-LB200 Optoelectronic Drying Oven is designed for baking and drying electronic and hardware products at temperatures below 200°C. Equipped with PID temperature control, adjustable air circulation, timing settings, and multi-level over-temperature protection, it ensures stable and reliable operation. The stainless-steel chamber offers excellent durability and corrosion resistance, making the oven especially suitable for LED diodes, digital displays, backlights, and similar optoelectronic products.
Read More
High Performance Fully Automatic Wire Bonding Machine for Advanced Semiconductor Packaging
HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.
Read More
Fully Automatic Wafer Grinding and Polishing Machine for Semiconductor Packaging
HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.
Read More
High-Precision Automatic Wire Bonder for Chips
HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires.
Read More
Semiconductor Packaging Die Bonding Microscope Stand
HY-DM2003 Die Bonding Microscope Stand is designed to provide stable microscope support for semiconductor die attach, bonding, and inspection processes. Its adjustable positioning allows operators to clearly observe chips and working areas, improving operational accuracy and convenience.
Read More
High-Speed & High-Precision Ultra-thin Die Bonder for advanced semiconductor packaging
HY-DP200 Die Bonder is a high-speed, high-precision die bonding system engineered for ultra-thin and advanced semiconductor packaging applications, supporting IC, LSI, BGA, CSP, QFN, NAND Flash, Mobile DRAM, eMMC, SiP, and small-die devices.
Read More
High-Performance Series Test & Taping Integrated Handler
HY-TT2401 Handler is a high-performance integrated handler that combines electrical testing, optical inspection, and taping packaging into a single automated system, designed for semiconductor packaging and test applications.
Read More
Wafer Thinning Machine for Hard and Brittle Semiconductor Materials
HY-WT9230 is developed for ultra-hard brittle semiconductor materials up to 12 inches. Built with dual air-bearing spindles and a high-precision grinding Z-axis, it supports fully automatic mirror thinning with high efficiency and damage-free processing. Equipped with a porous vacuum chuck and ultra-fine feed control, the machine ensures superior flatness and thickness uniformity for semiconductor wafer thinning processes.
Read More
High-Speed Series Test & Taping Integrated Machine
HY-TT1801 Test Sorter is applied to taping of discrete devices, ICs, DFN components and rectifier bridges.
Read More
High-Performance Series Linear Die Bonder for IC Packaging
HY-LD512H Die Bonding Machine is Linear Die Bonder a high-performance linear die bonder designed specifically for advanced IC packaging applications. Engineered to meet the rigorous demands of modern semiconductor manufacturing.
Read More
Fully Automatic Die Bonder for IC Packaging
HY-LD512 Die Bonder equipment is a fully automatic die bonder specially designed for IC die bonding and packaging.
Read More

One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Products

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration