Semiconductor Equipment Suppiler | Wire Bonder

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

High Precision Semiconductor TO252-6R Packaging MGP Mold
HY-PM252-6R professional MGP plastic sealing mold is custom-made for TO252-6R lead frame encapsulation. Featuring 6 mold boxes that process 12 lead frames per molding cycle, it fits all 550T and above plastic sealing presses. Constructed from DC53, ASP23 and tungsten steel with chrome-plated cavities, it is equipped with multi-zone temperature control and a quick-change structure. It delivers stable performance for mass IC packaging production and comes with fully interchangeable spare parts.
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Precision AB Glue Dispenser Two-component Glue Filling Machine
HY-TP700 Precision AB Glue Dispenser is designed for accurate A/B glue proportioning, mixing and quantitative dispensing. With an industrial PC, advanced motion control system and high-precision three-axis robotic arm, it delivers stable and efficient dispensing performance for PCB, electronic components, automotive accessories, lighting products and other applications.
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TO-220 320-Cavity MGP Encapsulation Mold
HY-PM220 is a TO220 MGP encapsulation mold featuring 320 cavities and 4 interchangeable mold cassettes, compatible with 450-ton and above molding presses. It adopts hard chrome plated cavities to maintain stable performance up to 100,000 shots, offering high-precision molding for semiconductor power device packaging with complete supporting spare parts.
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MGP Molding Mold for SMA SMB SMC
HY-PMS03 MGP molding mold fits SMA, SMB, SMC surface mount diodes and works with 400T+ molding presses. Each package has 4 mold boxes to form 8 lead frames at once. With quick swap mold boxes and chrome-coated wear-resistant alloy cavities, it reaches 200,000 shots. Plastic offset ≤0.05mm avoids overflow, bubbles and voids for steady mass production.
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MGP Plastic Molding Die for SOT23-20R Semiconductor Packaging
HY-PM23 MGP plastic molding die is customized for SOT23-20R semiconductor packaging. It is equipped with 6 mold boxes; each mold box holds 2 lead frames, with a total of 12 lead frames per full mold. All mold boxes and internal components are fully interchangeable and feature a quick disassembly and replacement structure.
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Automatic Lead Frame and Molding Compound Pellet Arranging Integrated Machine
HY-AU400 is an integrated machine serving as professional auxiliary equipment for IC plastic molding molds. It realizes automatic lead frame preheating and molding compound pellet arrangement. Fitted with robotic arms and multi-point temperature control, it adapts to all IC packaging varieties, reduces manual contamination, lifts production efficiency, and supports optional MES system networking.
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Semiconductor Molding Runner Flash Removal Punch Machine for All IC Packages
HY-MF300 is auxiliary equipment for plastic packaging molds, capable of one-time removing runner and gate residual flash for all IC packages. Equipped with Mitsubishi/Yonghong PLC control and full safety interlocks including light curtain, door sensor, E-stop and two-hand buttons, it delivers stable performance and universal compatibility for all semiconductor packaging production lines.
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Fully Automatic Deep Access Wedge Wire Bonder Aluminum Wedge Bonding Machine
The HY-WB900 Deep Access Wedge Wire Bonder is designed for chip-to-pin interconnection in advanced electronic component packaging. It supports hybrid circuits, COB, MCM, MEMS, RF, optoelectronic and automotive modules, featuring real-time bonding deformation monitoring, ultrasonic energy feedback, precise loop control and consistent tail wire management.
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Fully Automatic Lead Trimming, Forming and Singulation Equipment with Down Drive Mechanism
HY-TF200D is dedicated post-mold punching equipment for semiconductor packaging lines, integrating lead trimming, pin forming and component singulation in one automatic cycle. It supports SOT, EMC, TO, DIP and optocoupler packaging with an adjustable punching speed of 60–100 SPM. This machine is standard fitted with Mitsubishi/Yonghong PLC, servo-driven power system and complete safety protection. CCD visual inspection and MES system networking can be optionally equipped to meet intelligent digital packaging workshop demands.
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Dual Lower Flywheel Automatic Trim Form Singulation Machine for Semiconductor Lead Frame Processing
HY-TF200L adopts dual lower flywheel stamping system for semiconductor post-molding lead frame trimming, forming & singulation, compatible with SOT, TO, SOP and DIP packages. It runs 80–120 strokes per minute with PLC control and full safety interlocks, supporting optional CCD visual inspection and MES system networking. Comes with full series precision mold spare parts, it meets mass IC packaging production requirements.
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Fully Automatic IC Lead Trimming, Forming and Separating Machine with Top Power
HY-TF200U is specially designed for post-molding lead trimming, forming and separation of semiconductor packaging components. Compatible with SOT, TO, SOP, DIP, IPM, photovoltaic modules & optocouplers. Equipped with full servo drive system, dual magazine non-stop feeding, safety light curtain protection, optional CCD visual inspection and MES networking function, punching speed up to 30–60 SPM, stable high-efficiency mass production solution for IC packaging industry.
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Semiconductor Lead Frame Trimming Forming and Singulation Machine | High-Speed Punch System
HY-TF100 is designed for post-mold semiconductor IC lead trimming, pin forming and singulation. Compatible with mainstream miniature packages including SOT, SOD, TSOT and PDFN, it delivers a punching speed of 120–200 SPM. Featuring servo feeding and dual non-stop spring clamps, this equipment significantly boosts throughput of semiconductor packaging lines. It is equipped with complete safety protection as standard, while optional CCD visual inspection and MES networking are available to support smart factory digital management.
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One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Products

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration