Semiconductor Equipment Suppiler | Wire Bonder

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Vertical Single-Station Wafer Thinning Machine for Semiconductor Silicon
The HY-ST3002 handles 4–12 inch wafers for precision thinning and grinding of hard brittle semiconductors. Fully upgraded with mature processes, it features enhanced accuracy and stable long-run performance, with refined automatic thinning architecture and premium key parts: hydrostatic air-bearing grinding spindle, hydrostatic air-bearing wafer holding spindle, high-rigidity large-diameter rotary table.
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Die Bonder for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications
HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications.
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Precision Electronic Spot Welder Enameled Wires Single Side Spot Welding Machine
HY-PS3000 Precision Electronic Spot Welder is designed for direct welding of fine enameled wires and miniature electronic components. With stable pulse output and precise welding current adjustment, it ensures consistent, reliable joints and is suitable for high-precision applications in electronics, aerospace, medical devices, and other industries.
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High-Speed Die Bonder for Optoelectronic And Semiconductor
HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications.
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Fully Automatic Semiconductor Molding System for IC Packaging
HY-PS8180 Fully Automatic Semiconductor Molding System is designed for efficient encapsulation of ICs and power devices, ensuring stable quality and reliable protection.
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Fully Automatic AB Glue Precision Vacuum Potting Machine
HY-PM400 Fully Automatic Vacuum Potting Machine combines vacuum degassing, precision metering, dynamic mixing, three-axis dispensing and automatic cleaning. It automatically dispenses two-component adhesives under adjustable vacuum conditions to reduce bubbles and voids, making it suitable for automotive electronics, capacitors, coils, transformers, relays and power modules.
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Automatic Two-Component Glue Mixing And Potting Machine
HY-TP3030 Automatic Two-component Potting Machine combines a precision metering system with a high-accuracy three-axis motion platform to automatically meter, mix and dispense two-component adhesives. With vacuum feeding and degassing functions, it is suitable for automatic dispensing, potting and sealing of various electronic products.
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Fully Automatic Die Bonder for Ultra-High-Precision Optoelectronic
HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.
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Single-Side Wafer CMP Polishing Machine for Semiconductor Substrates
The HY-SP910 is equipped with PLC & touchscreen control system for simple setup, easy operation and stable performance. It performs ultra-precise single-sided polishing on thin components, supporting semiconductor substrates (sapphire, SiC, silicon & epitaxial wafers) as well as optical glass wafers, quartz crystals, ceramic wafers, stainless steel workpieces and fiber-optic connectors.
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Fully Automatic Die Bonder for Semiconductor Packaging
HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.
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Inline Automatic Two-Component Glue Potting Machine For Electronic Components
HY-PM3030 is an inline automatic two-component potting machine integrating conveyor transfer, precision metering, adhesive mixing and three-axis dispensing. It supports vacuum material feeding and degassing and can be connected with transfer conveyors, curing ovens and other automation equipment for potting, sealing and insulation of circuit boards, electronic components, automotive electronics, lighting products and small appliances.
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Ultrasonic Heavy Wire Bonder Aluminum Gold Ribbon Bonding Machine
HY-HW3018 Ultrasonic Heavy Wire Bonder is used for internal lead bonding of medium- and high-power transistors, MOSFETs, various power modules, high-current fast recovery diodes, Schottky diodes, thyristors, IGBTs, and other special semiconductor power devices.
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One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Products

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration