Products

HY-DD560P is dedicated production equipment for COB and COC processes. It mainly performs epoxy dispensing and die bonding between substrates (PCB or other carrier materials to be processed) and chips. Integrated with automatic loading/unloading, parallel dispensing & die picking, and multi-CCD vision positioning compensation full-automatic workflow, it enables stable high-precision die attaching and bonding, suitable for mass packaging production of optoelectronic and communication chips.

HY-CUS03 Automatic Push-Pull Glue Dispensing and Sorting System is an automatic push-pull glue dispensing and sorting system specifically designed for SMA, SMB, and SMC package products.

HY-PU001 Sealant Dispensing Machine processing machine is an automatic push-pull glue dispensing and sorting system specifically designed for TO252-6R package products. 

HY-PU001A Epoxy Dispensing Machine is an automatic push-pull glue dispensing and sorting system specifically designed for TO220 package products. 

HY-MD561P is developed for COB/COC multi-chip packaging. Equipped with linear motor and CCD vision positioning system, three independent pick-and-place heads, it supports auto feeding of 6-inch wafers and 2-inch waffle packs. Built-in through vision correction; optional syringe dispensing and UV curing systems can be configured to realize chip-substrate bonding.

HY-PM252-6R Molding is a high-precision molding mold designed for TO252-6R package products. The mold features a universal mold base capable of accommodating 6 mold boxes with quick mold box change design, utilizing a bottom-to-top multi-pot injection design driven by four built-in high-temperature-resistant, leak-proof hydraulic cylinders with a balanced injection head drive plate.

HY-WD1202 adopts imported RPS spindles, NSK precision transmission parts and Renishaw encoders for Y-axis closed-loop control with high positioning accuracy. It supports NCS height measurement, BBD blade detection, auto image recognition and on-wheel dressing, suitable for silicon, SiC/GaN wafers, ceramics, PCBs and optical glass. Applied to precision dicing for IC, power device and LED industries, the touchscreen machine has full pressure and temperature alarm protection. It offers multiple cutting modes for regular and complex workpieces, fitting for mass production in constant-temperature clean rooms.

The HY-GD001/HY-GD803/HY-GD001A Automatic Degating Machine is designed for removing gates and runners from molded semiconductor leadframes. It combines precise punching, automatic air blowing and waste collection, while the mistake-proof mold and safety light curtain ensure reliable and safe operation.

HY-WD802 comes with dual imported high-speed spindles, coaxial & ring dual vision, built-in NCS height measurement, BBD detection and on-wheel dressing. Equipped with NSK transmission and Renishaw closed-loop linear scale for excellent positioning precision, it performs precision cutting on silicon, SiC, GaN and compound wafers for power device, IC and optoelectronic ceramic mass production.

HY-TS936T Turret Sorting Machine is designed for tray-based handling of discrete devices and IC components.

HY-TS936P Turret Test Handler is designed for flexible testing and sorting applications. It supports multiple test stations, feeding methods and unloading configurations to meet diverse binning requirements and production capacity needs.

HY-PT8500 Push-Pull Tester is a high-precision multi-function push-pull tester designed for large-size PCB testing, Mini LED panel testing, and large-size sample testing.