Semiconductor Equipment Suppiler | Wire Bonder

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Semi-automatic Wafer Expander Wafer Film Expansion Machine for 6-inch Dicing Tape
HY-WE1130 Semi-automatic Wafer Expander is designed for 6-inch dicing tape processing. It uses electric heating to soften the tape and achieve uniform, flat wafer expansion. Manual loading, automatic waste film cutting and collection, safety light curtain protection, and dual-button operation ensure efficient and safe production.
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Full-automatic High-precision Double-Side Wafer Chamfering Machine for 4/6/8 Inch Silicon Wafers
HY-WC615 double-side wafer chamfering machine is equipped with CCD vision positioning & online thickness measurement modules, self-developed core mechanical components and full auto loading/unloading system, delivering outstanding machining precision and user-friendly touch operation for wafer chamfer processing.
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High Performance Wire Bonding & Chip Appearance Inspection Machine
HY-BI300P Aoi Machine is equiped with Post Semiconductor Packaging 2D+3D Full Dimension Quality Control Equipment covers all defects in wire bonding (gold wire / aluminum wire bonding) and chip appearance.
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Multifunctional Wire Bond Pull Tester Semiconductor Bond Testing Equipment
HY-PT6000 Wire Bond Pull Tester is designed for dynamic mechanical testing in semiconductor packaging, LED, SMT, BGA, automotive electronics, and sensor manufacturing. It supports pull, shear, and pull-out testing of bonding wires, solder balls, chips, ribbons, and pins, providing reliable evaluation of bonding strength and process quality.
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Fully Automatic Chip Appearance Inspection System for semiconductor packaging
HY-BI300 Aoi Equipment is a fully automatic 2D AOI inspection system engineered for semiconductor back-end quality assurance, addressing wire bonding and die surface defects across SIP, COB, IC, power devices, optical communication, and LED packaging applications.
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Semi-Automatic Wax Mounting Machine for Silicon and Compound Semiconductor Wafers
HY-SW360 is used for mounting compound semiconductor wafers on ceramic plates prior to thinning. It features precise quantitative solid wax dispensing, independent air cylinder pressing and accurate temperature control, achieving TTV ≤0.005 mm after mounting. Composed of mechanical, pneumatic-water and electrical control subsystems, it delivers stable high-precision wax mounting for wafer thinning processes.
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High-Precision Eutectic Bonding for Optical Communication
HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications.
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Eutectic Bonder for Automotive LED and Optoelectronic Semiconductor
HY-ED010 Die Bonding Machine is a Die bonding machine developed for Automotive LED and Optoelectronic Semiconductor Packaging applications.
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Fully Automatic Ultra-Precision Wafer Back Grinding Machine for IC Production Line
The HY-ST3005 handles 4–12 inch hard brittle semiconductor substrates for high-precision back thinning. Iteratively upgraded for superior accuracy and long-term stability, it features premium core assemblies (hydrostatic air-bearing grinding spindle, high-precision wafer spindle, high-rigidity large-diameter rotary table) and high automation for mass production of silicon and compound semiconductor wafers.
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Ultra-High-Precision Eutectic Bonder for Optoelectronic Device
HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
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High Performance Eutectic Bonder for Semiconductor
HY-ED003 Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
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Precision Semiconductor Wire Re-bonding Machine for PCB Re-bonding
HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.
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One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Products

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration