die bonder

HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications. 

HY-ED010 Die Bonding Machine is a Die bonding machine developed for Automotive LED and Optoelectronic Semiconductor Packaging applications. 

HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications. 

HY-ED003  Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications. 

HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications. 

HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications. 

HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.

HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.