die bonder

HY-DB812 Die Attach Equipment is a high-speed die bonding system designed for medium-to-high precision semiconductor packaging, supporting IC, QFN/DFN/BGA, power devices (IGBT/SiC), and MEMS sensors.

HY-PD12 Die Bonder is a high-precision panel-level die bonding system specifically designed for FOWLP/PLP advanced packaging processes, widely used in high-performance computing/AI chips, 5G/mmWave RF devices, SiP solutions, and Mini/Micro LED display panels.

HY-WP08 Wafer Sorting Machine is a wafer sorting system designed for semiconductor packaging processes including wafer grinding, dicing, and material sorting (wafer-to-tray, wafer-to-wafer, tray-to-tray). 

HY-ED08 Eutectic Bonding Machine is a high-precision eutectic die bonding system specifically engineered for SOT and SOD package types, designed for high-reliability power discrete devices including automotive-grade and industrial-grade MOSFETs and diodes.

 HY-GD08 Die Bonding Machine is a high-precision dispensing and die bonding system designed for power discrete devices, consumer ICs, and sensor production, supporting SOP, SOT, SOD, DFN, QFN, and DIP package types. 

HY-LD600 Die Sort & Placement Machine is a dedicated pick-and-place machine for LED display screens. It is designed for mass production of fine-pitch LED display modules, featuring low equipment procurement cost, high speed, high precision, and significant cost savings for customers by eliminating the need for LED component taping.

HY-DP200 Die Bonder is a high-speed, high-precision die bonding system engineered for ultra-thin and advanced semiconductor packaging applications, supporting IC, LSI, BGA, CSP, QFN, NAND Flash, Mobile DRAM, eMMC, SiP, and small-die devices.

HY-LD512H Die Bonding Machine is  Linear Die Bonder a high-performance linear die bonder designed specifically for advanced IC packaging applications. Engineered to meet the rigorous demands of modern semiconductor manufacturing.

HY-LD512 Die Bonder equipment is a fully automatic die bonder specially designed for IC die bonding and packaging.

HY-MD660M Die Attach Machine primarily applied to die bonding for chips and electronic devices in automotive electronics, aerospace, LiDAR, RF, TR components, consumer electronics and other fields. 

HY-MD660 Die Bonding machine primarily used for die attach of chips and electronic devices in automotive electronics, aerospace, LiDAR, RF, TR components, consumer electronics and other fields, compatible with various die/device feed formats, and supports fully automatic placement.

HY-OE3200 Die Bonding machine  is designed for eutectic bonding of power devices, LEDs, optical communication components such as LD, PD/TIA, etc., supporting a wide range of chip/device formats with fully automatic placement.