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This industrial vacuum plasma cleaner adopts 13.56MHz RF power and PLC touch control. Equipped with military-grade sealed chamber, dual plasma modes and dual adjustable gas channels, it stores up to 100 process recipes and delivers uniform plasma treatment.
Brand :
HYRNUSItem No. :
HY-EI160Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaIndustrial Production Vacuum Plasma Cleaner 165L Chamber for Semiconductor Packaging Mass Production
Product Introduction
HY-EI160 Industrial Production Vacuum Plasma Cleaner is a precision dry cleaning device. It specializes in processing hybrid integrated circuits, monolithic IC packages and ceramic substrates, widely used in semiconductors, electronic packaging, post-etch wafers, connectors and precision electronic parts.
It efficiently removes grease, organic residues and metal oxides, and achieves reliable surface activation for plastic, rubber, metal and ceramic materials.
Product Application
1. Cleaning: Remove organics, oxides, metal salts, nano-scale particle contaminants and other impurities.
2. Surface Activation: Modify hydrophilic & hydrophobic properties, raise surface energy, introduce functional groups, and improve biocompatibility.
3. Etching: Surface patterning, micro-etching, and adjustment of surface morphology & roughness.
4. Bonding: Bonding for microfluidic devices such as PDMS chips.
5. Stripping: Photoresist ashing, bottom film removal and other dry stripping processes.
Product Features
1. 13.56MHz high-density RF plasma generator with auto impedance matching, consistent plasma density delivers repeatable & stable processing results
2. Touchscreen PLC control with full safety interlock, stable control and user-friendly operation
3. Military-grade welded vacuum chamber with superior sealing and corrosion resistance
4. Storage capacity for 100 groups of process recipes, quick parameter recall to cut human operation errors
5. Dual working modes (direct plasma & downstream plasma) with adjustable working distance to fit diverse workpieces
6. Perforated parallel plate electrode design for evenly distributed plasma coverage
7. Two independent gas channels with precise flow control, easy to test different gas ratios for optimal cleaning performance
Machine Outline Drawing and Vacuum Chamber Diagram
Technical Specifications
| Category | Item | Parameter |
| 1. Plasma Generator Host | Solid-state power output | 0–1000W adjustable & displayable, standard sine wave output, stability ≤ ±0.5%; with overvoltage, overcurrent, over-temperature and reflected power protection |
| Anti-radiation RF impedance matcher | High-speed auto matching within 0.1s, supports network communication | |
| RF Frequency | 13.56 MHz | |
| 2. Vacuum Reaction Chamber | Chamber material | Aviation aluminum alloy with military-grade sealing |
| Chamber volume | 550×600×500 (W×D×H) mm, 165L | |
| Single-layer effective processing space | 510(W)×508(D)×30(H) mm | |
| 3. Discharge Electrode | Electrode material | Special high-conductivity aluminum alloy electrode |
| Processable layers | 8 layers (customizable) | |
| Gap between positive & negative plates | 51mm | |
| 4. Gas Circuit Control | MFC mass flow controller | 0–500 SCCM |
| Gas circuit design | Uniform inlet layout inside chamber to ensure uniform cleaning effect | |
| Process gas channels | 2 independent channels, compatible with oxygen, argon, etc. Notify us in advance if corrosive gas is required | |
| 5. Vacuum Measurement System | Measuring range | 5×10⁻² ~ 1.0×10⁻⁵ Pa |
| Measurement precision | 0.1Pa | |
| 6. Vacuum Pumping System | Vacuum pump set | 60 m³/h oil rotary vane pump + 300 m³/h Roots pump |
| Working vacuum degree | ≤30Pa | |
| Evacuation time | Within 100s | |
| Vent-to-atmosphere time | ≤30s | |
| Vacuum pipeline | Stainless steel pipeline with pneumatic valves | |
| 7. Control System | Control mode | PLC control |
| Real-time monitoring items | Vacuum degree, air pressure, output power, gas flow, working time | |
| Touch screen | 10-inch HMI touch panel | |
| Software program | Self-patented plasma control system with 3-level access authority; auto/manual modes, recipe setup/storage/recall, alarm history query, IO signal monitoring | |
| Alarm functions | Vacuum protection, glow discharge protection, power protection, air pressure alarm, phase sequence alarm | |
| Pressure balance function | Pre-chamber pressure balancing before gas inlet, adjustable balance duration | |
| 8. Site Utility Requirements | Power supply | Single-phase AC380V, 50/60Hz, 3-phase 5-wire, 31A |
| Gas pipe port | Diameter 6mm, PU pipe | |
| Required gas purity | ≥99.99% | |
| Compressed air pressure | 0.6–0.8MPa | |
| Air pressure detection | 2-channel auto-alarm pressure gauges | |
| Exhaust port standard | KF40 flange | |
| 9. Overall Machine Parameters | Total machine power | 11.5KW |
| Overall dimension | 1170mm(L) × 1190mm(W) × 1825mm(H) |
Operating Environment (Items to be Prepared by Customer)
| No. | Item | Requirements |
| 1 | Power Supply | 3-phase AC380V, 50/60Hz, grid fluctuation tolerance ±10%; grounding wire complies with international standards; no strong electromagnetic interference around the installation area |
| 2 | Gas Source Preparation | Gas cylinders for O₂, Ar, N₂, H₂ (with pressure reducing valves); pipe connector diameter: Φ6mm |
| 3 | Gas Pressure Range | 0.30MPa~1.00MPa (3Kgf~10Kgf) |
| • External pressure reducer needed if pressure exceeds 1MPa | ||
| • Machine auto stops & alarms when no gas supply or pressure <0.03MPa (0.3Kgf) | ||
| 4 | Exhaust Pipeline | Connect to vacuum pump exhaust port (required for cleanroom use) |
Product Details
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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