Plasma Cleaner

HY-EB03H 2.5L tabletop ICP treatment unit is compact lab plasma surface treatment equipment with 13.56MHz RF power and dual gas channels. It generates high-density ICP plasma for cleaning, activating, etching and bonding materials, and is widely used for PDMS microfluidics, photoresist ashing and semiconductor lab research.  

This industrial vacuum plasma cleaner adopts 13.56MHz RF power and PLC touch control. Equipped with military-grade sealed chamber, dual plasma modes and dual adjustable gas channels, it stores up to 100 process recipes and delivers uniform plasma treatment.

HY-PS13 is a CCP vacuum plasma system dedicated to wafer photoresist stripping, cleaning and surface activation. Popular in research labs and small-batch semiconductor production, its stainless steel chamber full set with pump & gas modules improves material surface adhesion and hydrophilicity for bonding, coating and thin-film processes.

HY-ES10 is an experimental plasma treatment system, widely adopted by research institutes, universities, corporate R&D labs and low-volume production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a vacuum chamber, plasma generator, vacuum pump, and gas inlet & exhaust ports. The treatment chamber is fabricated from square stainless steel.

HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.

HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.

HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.

 HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.

HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.