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HY-OE3200 Die Bonding machine is designed for eutectic bonding of power devices, LEDs, optical communication components such as LD, PD/TIA, etc., supporting a wide range of chip/device formats with fully automatic placement.
Brand :
HYRNUSItem No. :
HY-OE3200Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh-Speed Eutectic Bonder for Optical Communication
Product Introduction
HY-OE3200 Eutectic Bonder is designed for eutectic bonding of power devices, LEDs, optical communication components such as LD, PD/TIA, etc., supporting a wide range of chip/device formats with fully automatic placement.In the fields of optical communication, power devices, and LED packaging, placement accuracy and production efficiency directly determine device performance and manufacturing costs.
Key Technical Features
Featuring the industry-exclusive dual gantry structure, it delivers superior placement efficiency. With a maximum temperature of up to 450℃ and a hermetically sealed track design that provides a protective gas atmosphere, it ensures outstanding eutectic bonding results.
Application Scenarios
High-precision eutectic bonding for power devices, LEDs, and optical communication components such as COC/COS, LD, TIA, PD, etc.
Technical Specifications
| Item | Specification |
| Name | High-Speed Eutectic Bonder for Optical Communication |
| Model | HY-OE3200 |
| Placement Accuracy | X/Y Placement Accuracy: ±1.5 μm @ 3σ (calibration die) |
| CPH (±1.5 μm) | 500 (standard die, heating time = 7 s) |
| Die Size | 0.2–3 mm |
| Substrate Type | Single substrate, size 0.5–20 mm |
| Bond Force | 10–1000 gf |
| Supported Die Feeding Methods | Waffle pack, Gel pak, Wafer Expander Ring, Tray |
| Equipment Dimensions | 2200 × 1450 × 1750 mm (including loading/unloading module) |
| Equipment Weight | 2300 kg |
| Operating Environment | 23 ± 3°C / 40%–60% RH |
Product Details
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