High Precision Ultrasonic Wire Bonding Machine for Optical Devices

Product Introduction

The HY-WB500 High Precision Ultrasonic Wire Bonder is a standard planar wire bonding system for semiconductor and electronic component packaging. It supports customized rails, fixtures and magazines according to different customer products, providing flexible adaptation for various production requirements.

The machine is equipped with programmable auto-focus optical path, dual-frequency transducer, fully automatic material handling system and high-rigidity workholder structure. Its reliable motion control system and rigid X-Y table guide rail design help ensure accurate positioning and stable bonding quality. With PR Look Ahead and multi-channel, multi-stage EFO functions, the system improves bonding efficiency and process consistency.

Features

Technical Specifications

No.	Parameter	Specification
1.	Workholder (Customizable)
2.	Workholder Z Travel	13 mm
3.	Heater Temperature	Room temperature ~ 300°C
4.	Workholder X-Y Range	73 mm × 72.5 mm
5.	Operating System	Windows
6.	Bonding Travel	60 mm × 70 mm
7.	Min Bond Pad Pitch	45 μm
8.	Bonding Accuracy	±3 μm @ 3σ
9.	Wire Diameter	18 μm ~ 50 μm
10.	Max Wire Length	7 mm
11.	Min Loop Height	60 μm
12.	Loop Height Accuracy	±25.4 μm
13.	Wire Swing	±25 μm
14.	Loop Control	Fully programmable
15.	Optical Path	2~4 / 1.6~3.6 continuous zoom, programmable auto focus
16.	Standard Bonding Speed	45 ms/wire cycle time
17.	Auto Focus Distance (Z)	4 mm
18.	Chip Angle Tolerance	Rotation ±45°
19.	Chip Position Tolerance	X: ±190 μm, Y: ±140 μm
20.	Bonding Force	0~360 g
21.	Ultrasonic Power	0~2 W
22.	Compressed Air Requirement	0.35~1 MPa, Φ10 air fitting
23.	Input Voltage	AC 220V ± 10% (50 Hz)
24.	Rated Air Consumption	150 L/min @ 0.5 MPa
25.	Weight	Net: 650 kg
26.	Loop Modes	Q loop / S loop / BGA-Twist
27.	Dimensions (W×D×H)	1300 × 1000 × 1700 mm

 

Terms of Use

No	Item	Requirements
1.	Ambient Temperature (Room Temperature)	15°C ~ 30°C
2.	Ambient Relative Humidity	30% ~ 60% (no condensation)
3.	Vibration	Vibration may affect equipment accuracy; keep away from vibration sources
4.	Power Requirements	1. 220V AC ± 10%
		2. Power ≥ 2000W
		3. Frequency: 50Hz ± 1Hz
5.	Grounding	Must be properly grounded. Follow local regulations for grounding specifications.
6.	Others	- Ensure power supply is located near the machine
		- Precision leveling with a leveling instrument is required after installation on site
		- Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination
		- Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination
7.	Voltage	220V ± 10%
8.	Frequency	50/60Hz
9.	Grounding	Must be grounded
10.	Power	≥2000W
11.	Interface Specification	10A, Single-phase 3-wire