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HY-MD660 Die Bonding machine primarily used for die attach of chips and electronic devices in automotive electronics, aerospace, LiDAR, RF, TR components, consumer electronics and other fields, compatible with various die/device feed formats, and supports fully automatic placement.
Brand :
HYRNUSItem No. :
HY-MD660Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaMulti-Function High-Precision Die Bonder for Die Attach of Chips
Product Introduction
HY-MD660 Die Bonder adopting the industry’s unique overhead gantry structure, it provides a die bonding solution with larger travel range, smaller equipment footprint, and more stable accuracy.
Capable of achieving high-precision die bonding with ±5μm accuracy, meeting your requirements for high-precision and multi-functional die attach processes.
Key Applications
Multi-Chip Packaging (Face-Up & Flip-Chip)
TR Components
DCIAC (Data Center & Interconnect Application Components)
Microwave Modules
Optical Modules
General Semiconductor Packaging
Key Technical Features
±5µm High-Precision Die Bonding
Placement accuracy: ±5µm @3σ
Rotational accuracy: ±0.1° @3σ
Max vision accuracy: 1.7µm
Working area: 300 × 200 mm
Optional non-contact laser height measurement module
Supports dispensing
Supports spray coating and dipping processes
Supports automatic change of up to 5 EA dipping nozzles
Supports "place-then-dispense" process flow
Supports automatic change of up to 14 EA nozzles
Supports automatic change of up to 5 EA ejector pins
Supports automatic accuracy calibration
Supports automatic thermal deformation compensation
Technical Specifications
| Item | Parameters |
| Name | Multi-Function High-Precision Die Bonder |
| Model | HY-MD660 |
| Placement Accuracy | ±5 µm @ 3σ (calibration chip) |
| Rotation Accuracy | ±0.1° @ 3σ |
| CPH | CPH ±10 µm: 2500 (standard die) |
| CPH ±7 µm: 1500 (standard die) | |
| CPH ±5 µm: 1000 (standard die) | |
| Die Size | 0.15~50 mm |
| Max Substrate Size | 300 × 200 mm |
| Bond Force | Optional: 10~1000 gf, 50~5000 gf |
| Supported Substrates | FR4, lead-frame, strips, carrier, boat, ceramics, wafer |
| Supported Die Types | Wafer ring, Waffle pack, Gel pak, Feeder, Wafer Expander Ring, Tray |
| Equipment Dimensions | 2510 × 1450 × 1700 mm (including loader/unloader) |
| Equipment Weight | 2000 kg |
| Power Supply | 220 V 50/60 Hz / 2.5 kVA |
| Operating Environment | 23±3°C / 40%~60% RH |
Product Details
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