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HY-TH820 Turret Sorter is a turret-style integrated test system designed for semiconductor final test (FT) applications, specifically supporting DFN0603, DFN0606, DFN1006, DFN1010, and DFN1107 package types.
Brand :
HYRNUSItem No. :
HY-TH820Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh Throughput Test Handler Semiconductor Suitable for DFN Package
Product Introduction
HY-TH820 Chip Sorting Machine delivers a throughput of 50,000 UPH with high precision, high efficiency, and high stability, significantly increasing production capacity while enabling precise quality control. The system features a bowl feeder feeding method, 4 test stations with TTL interface, and supports 20 or 24 nozzles. It achieves MTBA of ≥60 minutes and MTBF of ≥168 hours, ensuring reliable long-term operation. The HY-TH820 measures 1000 × 1100 × 1600 mm and weighs 900 kg, operating on either 3-phase 380V or single-phase 220V with power consumption of 3000 W and requiring compressed air of 5 kgf/cm². It is widely applied in IC packaging and testing, discrete device manufacturing, and related fields.
Feature
High efficiency
High stability
High precision
Help significantly increase production capacity and enable precise quality control
Technical Specifications
| Parameter | Specification |
| UPH | 50,000 PCS |
| Feeding Method | Bowl feeder |
| Test Stations & Interface | 4 test stations, TTL interface |
| Number of Nozzles | 20 / 24PCS |
| MTBA | ≥ 60 min |
| MTBF | ≥ 168 hr |
| Dimensions (L×W×H) | 1000 × 1100 × 1600 mm |
| Weight | 900 kg |
| Compressed Air | 5 kgf/cm² |
| Power Supply | 3-phase 380V or single-phase 220V |
| Power | 3000 W |
Process
Module
Vibration Bowl Feeder Module
DFN Test Module
Alignment and Orientation Module
Product Details
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