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The HY-WB800 Fully Automatic Deep Access Wire Bonder is designed for internal chip interconnection in advanced electronic packaging. It is widely used in hybrid circuits, MCM, MEMS, RF, microwave, optoelectronic, and automotive modules. It features real-time bonding and ultrasonic monitoring, precise loop control, EFO system, and high-stability wire feed for reliable high-end applications.
Brand :
HYRNUSItem No. :
HY-WB800Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaMEMS Deep Access Wire Bonder BBOS Wire Bonding Equipment
Product Introduction
The HY-WB800 Fully Automatic Deep Access Wire Bonder is suitable for the internal pin interconnection process of chips in the production of special electronic components and is one of the key pieces of equipment in electronic component packaging. It is mainly used in hybrid circuits, COB modules, MCMs, MEMS devices, RF devices/modules, optoelectronic devices, microwave devices, military devices, high-end optoelectronic devices, automotive electronic modules, and other electronic components.
Features
| No. | Feature |
| 1 | Real-time BMS (bond quality) solder joint inspection |
| 2 | Real-time ultrasonic energy monitoring, providing welding energy feedback control |
| 3 | Fixed-length and fixed-height arc control |
| 4 | Piezoelectric motor tail wire control mechanism, ensuring tail wire consistency |
| 5 | Compatibility with 16mm and 19mm capillaries |
| 6 | High-definition bond head maintenance image auxiliary tool |
| 7 | Capable of zero wire tail bumping (stud bumping) function |
| 8 | Equipped with negative high-voltage electronic flame-off (EFO) unit |
| 9 | Supports active wire feed with wire clamp |
Technical Specifications
| No. | Parameter | Specification |
| 1. | Bonding Accuracy | ±3 μm @ 3σ |
| 2. | Bonding Force | 0~220 g |
| 3. | Bonding Area | X: 305 mm, Y: 457 mm |
| 4. | Capillary Length | 16 mm, 19 mm |
| 5. | Z Travel Range | 40 mm |
| 6. | Wire Types | Gold wire (18~75 μm) |
| 7. | P Rotation Range | 0~180° |
| 8. | Bonding Speed | ≥ 4 wires/s |
| 9. | Loop Control | Fully programmable |
| 10. | Spool Size | 2 inch |
| 11. | Ultrasonic Range | 0~4 W control accuracy, stepped flexible application capability |
| 12. | Workholder Temperature Range | Room temperature ~ 250°C |
| 13. | Cavity Depth Range | Max. 12 mm |
| 14. | Operating System | Windows 10 |
Terms of use
| No | Item | Requirements |
| 1. | Footprint (W×D×H) | ≤1000 × 1500 × 1700 mm (excluding monitor space) |
| 2. | Equipment Weight | Approx. 1200 kg |
| 3. | Ambient Temperature | Normal room temperature (20°C ~ 26°C); high temperature operation will affect equipment service life |
| 4. | Compressed Air Requirement | 0.4~0.8 MPa, flow rate >150 L/min (dry treatment, dust removal, oil-water separation) |
| Residual oil content: 0.01 ppm; Filtration: particles >0.01 μm; Low dew point temperature: -20°C | ||
| 5. | Ambient Humidity | ≤60% relative humidity |
| 6. | Ambient Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 7. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 8. | Others | - Ensure power supply is located near the machine |
| - Precision leveling with a leveling instrument is required after installation on site | ||
| - Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination | ||
| - Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination | ||
| 9. | Voltage | 220V ± 10% |
| 10. | Frequency | 50/60Hz |
| 11. | Grounding | Must be grounded |
| 12. | Power | ≤ 500W |
| 13. | Interface Specification | 5A, Single-phase 3-wire |
Product Details
FAQs
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