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The HY-DA300 Multi-chip Die Attach Machine is specifically designed for multi-chip fully automatic placement processes in the packaging of electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing.
Brand :
HYRNUSItem No. :
HY-DA300Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaMulti-chip Die Attach Machine Automatic Die Bonder for System-in-Package
Product Introduction
The HY-DA300 Multi-chip Die Attach Machine is designed for multi-chip placement processes in electronic component packaging. It adopts a gantry dual-drive platform to ensure high placement accuracy and stable operation, and supports fully automatic multi-chip placement for system-in-package assembly. The machine is equipped with upper and lower vision positioning, high-precision force control up to ±2 g, and in-line mechanical height measurement with accuracy up to ±1 μm. With a fast horizontal nozzle changer, optional 12-nozzle rotary disc, conveyor line operation, and SECS/GEM data collection support, it is suitable for hybrid circuits, COB, MCM, MEMS, RF and optoelectronic modules.
Equipment Performance
| No. | Feature |
| 1 | Gantry dual-drive platform to ensure placement accuracy and stability |
| 2 | Fast and high-precision horizontal nozzle changer |
| 3 | Fully automatic multi-chip placement, capable of system-in-package (SiP) assembly |
| 4 | High-precision force control, accuracy up to ±2 g |
| 5 | Upper and lower vision high-precision positioning function |
| 6 | Conveyor line operation, maximum compatible carrier width 150 mm |
| 7 | Horizontal rotary nozzle disc, up to 12 nozzles optional, maximum cavity depth 15 mm |
| 8 | Integrated in-line mechanical height measurement, nozzle height measurement, accuracy up to ±1 μm |
| 9 | Optional vacuum pump and air compressor |
| 10 | Supports SECS/GEM data collection protocol |
Technical Specifications
| No. | Parameter | Specification |
| 1. | Position Accuracy | ±3 μm @ 3σ |
| 2. | Angle Accuracy | ±0.15° @ 3σ |
| 3. | Height Measurement Accuracy | ±1 μm |
| 4. | Chip Size | Min: 0.2mm × 0.2mm, Max: 15mm × 15mm |
| 5. | Waffle Tray / Magnetic Drum Tray Size | 2 inch, 4 inch |
| 6. | Waffle Tray / Magnetic Drum Tray Quantity | 22 units of 2 inch + 2 units of 4 inch; or 30 units of 2 inch |
| 7. | Number of Nozzles | 12 |
| 8. | Travel Range | X-axis 386mm, Y-axis 716mm, Z-axis 50mm |
| 9. | Maximum Depth | 15 mm |
| 10. | Cavity Depth Range | Max. 15 mm |
| 11. | Height Measurement Method | Contact type |
| 12. | Bonding Force | 15~500 g |
| 13. | Force Control Accuracy | ±2 g |
| 14. | UPH | 1200 |
| 15. | Operating System | Windows |
| 16. | Input Voltage | 220V ± 10% @ 50/60Hz |
| 17. | Rated Power | 1 kW |
| 18. | Footprint (W×D×H) | 970mm × 1570mm × 2040mm |
| 19. | Compressed Air Requirement | 0.4~0.6 MPa |
| 20. | Vacuum Line Pressure | ≤ -85 kPa |
| 21. | Equipment Net Weight | 1.3 T |
Terms of Use
| No | Item | Requirements |
| 1. | Footprint (W×D×H) | 970mm × 1570mm × 2040mm (excluding monitor space) |
| 2. | Equipment Weight | 1300 kg |
| 3. | Ambient Temperature | Normal room temperature (20°C ~ 24°C); high temperature operation will affect equipment service life |
| 4. | Compressed Air Requirement | 0.4~0.6 MPa, flow rate >150 L/min (dry treatment, dust removal, oil-water separation, pressure regulation); air hose outer diameter: 10 mm |
| 5. | Vacuum Line Pressure | ≤ -85 kPa |
| 6. | Ambient Humidity | <60% relative humidity |
| 7. | Ambient Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 8. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 9. | Others | - Ensure power supply is located near the machine |
| - Precision leveling with a leveling instrument is required after installation on site | ||
| - Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination | ||
| - Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination | ||
| 10. | Voltage | AC 220V ± 10% |
| 11. | Frequency | 50/60 Hz |
| 12. | Grounding | Must be grounded |
| 13. | Power | ≥ 1000 W |
| 14. | Interface Specification | 10A, Single-phase 3-wire |
Product Details
FAQ
Yes. The HY-DA300 supports fully automatic multi-chip placement and is capable of system-in-package (SiP) assembly.
The placement accuracy is ±3 μm @ 3σ, which supports high-precision die bonding and multi-chip placement applications.
Yes. It is equipped with a fast, high-precision horizontal nozzle changer for efficient multi-chip placement.
The bonding force range is 15–500 g, with force control accuracy up to ±2 g.
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