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1

IC Packaging Testing Wire Bond Pull Test Machine

HY-PT8600 Wire Bond Pull Test Machine performs wire pull, solder joint thrust, chip shear and BGA fatigue testing.

  • Brand :

    HYRNUS
  • Item No. :

    HY-PT8600
  • Order(MOQ) :

    1 Set
  • Warranty :

    One-Year Warranty and Lifetime Maintenance
  • Payment :

    T/T
  • Lead Time :

    7-35 Days
  • Product Origin :

    China
  • IC Packaging Testing Wire Bond Pull Test Machine

    Product Introduction

    The HY-PT8600 Wire Bond Pull Test Machine is capable of conducting post-bonding wire solder joint strength testing for microelectronics, adhesive strength testing between solder joints and substrate surfaces, and repeatability thrust fatigue testing of solder balls. It includes internal wire tensile testing, micro-solder joint thrust testing, gold ball thrust testing, chip shear force testing, SMT component thrust testing, and BGA matrix overall thrust testing.

     

    Application

    • LED packaging testing
    • IC semiconductor packaging testing
    • TO package testing
    • IGBT power module packaging testing
    • Optoelectronic component packaging testing
    • Automotive sectors
    • Aerospace industries
    • Military product testing
    • Research institute evaluations
    • Testing/research activities across various academic institutions.

     

    Main Functions

    The primary functions of this equipment are to conduct post-bonding wire strength testing for microelectronic leads, assess the adhesion strength between solder joints and substrate surfaces, and evaluate the bonding strength between wafers and frame surfaces.

     

    Product Features

    No. Item Description
    1 Positioning Control System Five-axis positioning control system with X/Y-axis travel 100mm and Z-axis travel 80mm; ergonomic design with Hall-effect joysticks for intuitive XYZ platform control, featuring comprehensive safety protection.
    2 Mechanical Structure & Test Force 200kg robust chassis construction, Y-axis max test force 100kg, Z-axis max test force 20kg
    3 Workstation System Intelligent workstation auto-change system eliminates manual module replacement, enhancing testing efficiency and convenience
    4 Measurement Performance High-precision dynamic sensors integrated with specialized mechanical algorithms ensure stable and reliable measurement accuracy across environments
    5 Lighting System Smart LED lighting system: Automatically deactivates during idle periods and activates upon operation

     

    Equipment Specifications

    Item Specification
    Model HY-PT8600
    Dimensions 660mm × 610mm × 800mm (including left and right operating handles)
    Weight Approximately 95kg
    Power Supply 110V/220V@3.0A 50/60Hz
    Air Supply 4.56Bar
    Control Computer Lenovo/HP Original PC
    Operating System Genuine Windows 10/Windows 11
    Microscope Standard high-definition continuous zoom microscope (optional trinocular microscope plus high-definition CCD camera)
    Sensor Change Method Automatic switching (after selecting test items in software, corresponding sensors automatically move to test stations)
    Platform Fixture 360-degree rotation; platform compatible with various test fixtures
    XY-axis Lead Screw Effective Travel 100mm × 100mm (expandable to 200mm × 200mm with vacuum platform), maximum test force 100kg
    XY-axis Maximum Traverse Speed Free control via Hall-effect joystick, maximum speed 6mm/s
    XY-axis Lead Screw Precision Repeatability ±5μm, resolution 0.125μm; accuracy within 2mm ±2μm
    Z-axis Lead Screw Effective Travel 100mm. Resolution 0.125μm. Maximum test force: 20kg.
    Z-axis Maximum Traverse Speed Utilizes Hall-effect joystick for free Z-axis control, maximum traverse speed 8mm/s.
    Z-axis Lead Screw Accuracy ±2μm. Shear accuracy: Within 2mm, repeat positioning accuracy ±1μm.
    Sensor Accuracy ±0.003%; overall test accuracy ±0.1%
    Equipment Fixtures Custom-designed fixtures based on samples or drawings (one set supplied as standard)
    Equipment Calibration Calibration fixtures and weights supplied as standard
    Quality Assurance 2-year warranty on entire unit; lifetime free software upgrades (excluding damage caused by human error)
    Sensor Accuracy Sensor accuracy: ±0.003%; Comprehensive test accuracy: ±0.1%
    Test Accuracy Automatic range switching for test sensors
      Multi-point linear accuracy calibration, repeatability testing with standard weights to ensure data accuracy
    Software Vacuum 360° freely rotating test platform, suitable for various materials. Testing for multiple materials can be easily realized by replacing corresponding fixtures or pressure plates
    Parameter Setting Parameters such as pass/fail force values, shear height, test speed can be adjusted according to different permission levels

     

    Product Details

    Multi-functional Push-Pull Testing machinebond tester machine

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Contact us:allen@hyrnus.com