HY-PT8600 Wire Bond Pull Test Machine performs wire pull, solder joint thrust, chip shear and BGA fatigue testing.
Brand :
HYRNUSItem No. :
HY-PT8600Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
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