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HY-LD512 Die Bonder equipment is a fully automatic die bonder specially designed for IC die bonding and packaging.
Brand :
HYRNUSItem No. :
HY-LD512Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic Die Bonder for IC Packaging
Product Introduction
HY-LD512 Die Bonder supports 12-inch and 8-inch wafer processing, and is compatible with high-density lead frames of various sizes for mounting applications, including QFN, SOP and other packages.
Hardware System
Innovative pick-up mechanism
Industry-leading pick-up speed solution
Optimized structure with superior accuracy
Accuracy up to 20 μm at high-speed operation
Maximum speed up to 14K/H
Multi-functional design for cross-industry applications
Vision System
Supports multiple configuration options
Compatible with various product sizes: 1.0×1.0–3.5×3.5 mm
Self-developed visual recognition algorithm
Equipment Features
Adopts an independent dispensing control system for more precise glue volume control; equipped with 2 types of dispensing nozzles (compatible chip size: 0.5–5 mm)
High-precision linear-driven die bonding head; voice coil torque ring for accurate die bonding pressure control
High-precision chip search platform; servo motor-driven chip angle correction system, with an automatic wafer expanding system (12-inch)
Vacuum die missing detection; with pre- and post-bonding quality inspection functions
Industrial PC controls equipment operation, simplifying automation equipment operation
Equipped with wafer mapping function
Bond head with 360° rotation capability
Combined single-pin and multi-pin ejector system
ESD protection socket (for wrist strap connection) on the equipment
One 220V power socket with safety cover on the equipment (for powering other electrical devices)
Built-in ionizer fan
Key Technical Specifications
| HY-LD512 Series Specifications | |
| System Function | |
| Wafer Compatibility | 8" / 12" wafers |
| Throughput (UPH) | Max. 230 MS (depending on die size and lead frame carrier) / 14,000 UPH |
| Die Attach Accuracy | ±20 µm |
| Die Rotation Accuracy | Chip size ≥ 1 mm: ±1°Chip size < 1 mm: ±3° |
| Supported Processes | FOWLP, Die Bonding, Clip Bonding |
| Device Configuration | |
| Chip Size Range | 0.25 × 0.25 mm – 10 × 10 mm |
| Maximum Wafer Size | 12" |
| Maximum Wafer Angle Correction | ±180° |
| Resolution | 1 µm |
| Lead Frame Carrier | |
| Lead Frame Length | 110 mm – 300 mm |
| Lead Frame Width | 30 mm – 100 mm |
| Lead Frame Thickness | 0.12 mm – 0.76 mm |
| Image Recognition System | |
| Grayscale Levels | 256-level gray scale |
| Resolution | 656 × 492 pixels |
| Recognition Accuracy | ±0.025 mil @ 50 mil observation range |
| Electrical Parameters | |
| Voltage / Frequency | 220V AC ±5% / 50 Hz |
| Rated Power | 2500 W |
| Pressurized Air Requirement | 0.5 MPa (min.) |
| Air Consumption | 40 L/min |
| Mechanical Dimensions | |
| Dimensions (L × W × H) | L 2300 × W 1400 × H 1550 mm |
| Weight | 2000 kg |
Customer Application Cases（Die Bonder Operation）
Product Details
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