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HY-LD512H Die Bonding Machine is Linear Die Bonder a high-performance linear die bonder designed specifically for advanced IC packaging applications. Engineered to meet the rigorous demands of modern semiconductor manufacturing.
Brand :
HYRNUSItem No. :
HY-LD512HOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh-Performance Series Linear Die Bonder for IC Packaging
Product Introduction
HY-LD512H Series Linear Die Bonder system delivers exceptional placement accuracy, high throughput, and broad process flexibility, making it an ideal choice for both volume production and emerging packaging technologies.At the core of the HY-LD512H is its advanced linear motor architecture, which ensures smooth, vibration-free motion and superior positional stability. This enables a die attach accuracy of ±20 µm and precise rotational control, with angular accuracy maintained within ±1° for chips larger than 1 mm and ±3° for smaller devices. Such precision is critical for ensuring reliable electrical performance and process yield in fine-pitch and high-density packages.
Key Technical Specifications
| HY-LD512H Series Specifications | |
| System Function | |
| Wafer Compatibility | 8" / 12" wafers |
| Throughput (UPH) | 16,000 UPH / Max. 230 MS (depending on die size and lead frame carrier) |
| Die Attach Accuracy | ±20 µm |
| Die Rotation Accuracy | Chip size ≥ 1 mm: ±1°Chip size < 1 mm: ±3° |
| Supported Processes | FOWLP, Die Bonding, Clip Bonding |
| Device Configuration | |
| Chip Size Range | 0.25 × 0.25 mm – 10 × 10 mm |
| Maximum Wafer Size | 12" |
| Maximum Wafer Angle Correction | ±180° |
| Resolution | 1 µm |
| Lead Frame Carrier | |
| Lead Frame Length | 110 mm – 300 mm |
| Lead Frame Width | 30 mm – 100 mm |
| Lead Frame Thickness | 0.12 mm – 0.76 mm |
| Image Recognition System | |
| Grayscale Levels | 256-level gray scale |
| Resolution | 656 × 492 pixels |
| Recognition Accuracy | ±0.025 mil @ 50 mil observation range |
| Electrical & Pneumatic Specs | |
| Voltage / Frequency | 220V AC ±5% / 50 Hz |
| Rated Power | 2500 W |
| Pressurized Air Requirement | 0.5 MPa (minimum) |
| Air Consumption | 40 L/min |
| Mechanical Dimensions | |
| Dimensions (L × W × H) | L 2300 × W 1450 × H 1550 mm |
| Weight | 2200 kg |
Customer Application Cases（Die Bonder Operation）
Product Details
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