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HY-MD660M Die Attach Machine primarily applied to die bonding for chips and electronic devices in automotive electronics, aerospace, LiDAR, RF, TR components, consumer electronics and other fields.
Brand :
HYRNUSItem No. :
HY-MD660MOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaMINI High Performance Die Bonder for Chips and Electronic Devices
Product Introduction
HY-MD660M Die Bonder supports various die/device feed formats and fully automatic placement. Sharing the same structure as the HY-MD660, it only removes the independent dispensing module, further reducing the device footprint.
Key Applications
Multi-Chip Packaging (Face-Up & Flip-Chip)
TR Components
DCIAC (Data Center & Interconnect Application Components)
Microwave Modules
Optical Modules
General Semiconductor Packaging
Key Technical Features
Adopting the industry-unique overhead gantry structure, it delivers a die bonding solution with larger travel range, smaller equipment size, and more stable accuracy.
It enables global high-precision die bonding at ±5µm, meeting your requirements for high-precision, multi-functional and highly compatible die bonding processes.
±5µm High-Precision Die Bonding
Placement accuracy: ±5µm @3σ
Rotational accuracy: ±0.1° @3σ
Max vision accuracy: 1.7µm
Working area: 300 × 200 mm
Optional non-contact laser height measurement module
Supports automatic change of up to 14 EA nozzles
Supports automatic change of up to 5 EA ejector pins
Integrated bondhead dispensing function
Supports "place-then-dispense" process flow
Technical Specifications
| Item | Parameters |
| Name | Multi-Function High-Precision Die Bonder |
| Model | HY-MD660M |
| Rotation Accuracy | ±0.1° @ 3σ (calibration die) |
| Placement Accuracy | X/Y placement accuracy: ±5µm @ 3σ (calibration die) |
| Rotation Range | Bondhead rotation angle: 0~360° |
| CPH | CPH ±10µm: 2500 (standard die) |
| CPH ±7µm: 1500 (standard die) | |
| CPH ±5µm: 1000 (standard die) | |
| Die Size | 0.15~50 mm |
| Max Substrate Size | 300 × 200 mm |
| Bond Force | Optional: 10~1000 gf, 50~5000 gf |
| Supported Substrates | FR4, lead-frame, strips, carrier, boat, ceramics, wafer |
| Supported Die Types | Wafer ring, Waffle pack, Gel pak, Feeder, Wafer Expander Ring, Tray |
| Equipment Dimensions | 2190 × 1450 × 1700 mm (including loader/unloader) |
| Equipment Weight | 2000 kg |
| Power Supply | 220 V 50/60 Hz / 2.5 kVA |
Product Details
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