High-Speed & High-Precision Ultra-thin Die Bonder for advanced semiconductor packaging

HY-DP200 Die bonding machine delivers a throughput of 6K UPH for epoxy bonding and 3.5K UPH for DAF bonding, with bond accuracy of ±10 µm (X/Y) and ±0.1° (θ), and epoxy bond accuracy of ±20 µm (X/Y) and ±1.0° (θ). The system accommodates die sizes from 0.5 mm to 20 mm, handles 8" and 12" wafers with auto-theta alignment and auto-expanding functions, and supports substrates up to 300 mm in length. Equipped with a 5-megapixel vision camera (2048 × 2048 pixels) and 256-level grayscale pattern recognition, it achieves position accuracy of ±4 pixels and angular accuracy of ±0.01° over a 20 × 20 mm FOV. The bond head provides bonding force from 0.5N to 30N (optional) with load cell auto-calibration, pre/post vision inspection, and Z-level auto-calibration. Operating on AC 200–240V ±10% single-phase 50/60Hz with a power consumption of approximately 2.2 kW, it requires compressed air over 5 kgf/cm² and vacuum below -750 mmHg. With dimensions of 2200 mm × 1460 mm × 1800 mm (with FFU) and a weight of approximately 2300 kg, the HY-DP200 offers high reliability with MTBA of 120 minutes and MTBF of 168 hours in a Class 1000 clean environment, making it an ideal solution for precision die attachment in high-volume manufacturing.

Key Technical Specifications

HY-DP200 Series Specifications
System Productivity	UPH
	DAF: 3.5K UPH, Epoxy: 6K UPH
Application Package		IC, LSI, BGA, CSP, QFN, NAND Flash, Mobile DRAM, eMMC, SiP, Small Die
System Capability	Epoxy Bond Accuracy	X/Y: ±20 µm, θ: ±1.0°
	Bond Accuracy	X/Y: ±10 µm, θ: ±0.1°
	MTBA	120 minutes
	MTBF	168 hours
	Clean Class	1000 Class
	Control	PC-based
	Bond Method	Epoxy Paste & DAF
Material Handling Capability	Die Size	0.5 - 20 mm
	Substrate	Length: 100 - 300 mm; Width: 50 - 100 mm
	Magazine	Length: 110 - 320 mm; Width: 40 - 110 mm; Height: 100 - 190 mm
Wafer System	Wafer Handling	8", 12"
	Auto-Theta Alignment	360° Rotation
	Auto-Expanding	10 mm
Bond Head	Bond Force	0.5 - 5N ±15%, 5 - 30N ±5% (Up to 30N: optional)
	Bond Head Axis	X-Y-Z-Theta Axis (Single)
Measure & Inspection System	Features	Force auto calibration of Load cell reedback,Pre/Post Vision Inspection Z level auto calibration
Pattern Recognition System	PR System	256 Grey Levels
	Camera	5 mega vision camera (2048 × 2048)
	FOV	20 × 20 mm
	Position Accuracy	±4 pixel
	Angular Accuracy	±0.01°
Electrical Parameters	Voltage	AC 200~240V ±10%
	Frequency	Single-phase 50/60Hz
	Compressed Air	Over 5 kgf/cm²
	Vacuum	-750 mmHg below
	Power Consumption	Approx. 2.2 kW
Size/Weight (Estimate)	Dimensions (W × D × H)	2200 × 1460 × 1800 mm (with FFU 115H)
	Net Weight	Approx. 2300 kg

Product Details