High Precision Automatic Eutectic Bonding Machine for High-Reliability Power Discrete Devices

HY-ED08 Die Bonder achieves a cycle time of 140 ms with throughput of 25K UPH, delivering X/Y positioning accuracy of ≤ ±30 μm, rotation accuracy of ≤ ±3°, and placement accuracy of ±2 μm. The system handles 8" wafers with chip sizes from 0.15 × 0.15 mm to 1 × 1 mm and lead thickness ≥150 μm, accommodating lead frames of 28–80 mm in width and 0.1–0.3 mm in thickness. Equipped with a 720 × 540 pixel camera offering 256 grayscale levels and recognition accuracy of 1/2 pixel (3.4 μm) over a 16 × 16 mm range, the system features a dual-head bond head with mechanical bonding force of 30–250 g, 6 temperature zones with a maximum of 500°C, and supports reel material feed. Operating on 220V / 50Hz with rated power of 3 kW and air consumption of 10 L/min (with external vacuum) or 220 L/min (without), the HY-ED08 R8 delivers low-stress, low-thermal-resistance eutectic bonding with high precision and reliability for mass production applications.

Technical Specifications

Item	R8	R8-L
Operating System	Windows 7
Cycle Time	140 ms	220 ms
UPH	25K	16K
X/Y Position Accuracy	≤ ±30 μm
Rotation Accuracy	≤ ±3°
Wafer Size	8"
Chip Size	0.15×0.15–1×1 mm	0.3×0.3–2×2 mm
Lead Thickness	≥150 μm
Lead Frame Width	28–80 mm
Lead Frame Thickness	0.1–0.3 mm
Magazine Length	190–290 mm
Magazine Width	32–95 mm
Magazine Height	100–155 mm
Camera	256 grayscale levels
Image Resolution	720×540 pixels
Recognition Accuracy	1/2 pixel (3.4 μm)
Recognition Range	16×16 mm
Bond Head	Dual Head	Linear Type
Bond Force	30–250 g (Mechanical)	20–250 g (Programmable)
Bonding Method	Surface Pickup
Bonding Area	85×15 mm
Placement Accuracy	±2 μm
Temperature Zones	6	8
Max Temperature	Max. 500°C
Auto Feed	Not Supported
Auto Loading	Not Supported
Reel Material Feed	Supported
Z Stroke	0–4 mm
Top Needle Adjust	Electric
Multi-needle	Optional
Power Supply	220V / 50Hz
Compressed Air	0.6–1.0 MPa
Vacuum	-0.6 ~ -1.0 KPa
Rated Power	3 KW	3.2 KW
Air Consumption	10 L/min (with external vacuum)	10 L/min (with external vacuum)
	220 L/min (without vacuum)	120 L/min (without vacuum)
Dimensions	Upper unit (L × W × H)	1250 × 1100 × 1500 mm (excluding tower light)
	Lower unit (L × W × H)	950 × 740 × 1350 mm
	Feeder size (L × W × H）	700 × 300 × 800 mm
Weight	Upper unit	800 kg
	Lower unit	150 kg

Application Scenarios

This SOT/SOD eutectic bonding machine is engineered for high-reliability die bonding of power discrete devices. Featuring low-stress, low-thermal-resistance eutectic processes, it is widely applied in the mass production of MOSFETs and diodes for automotive-grade, industrial-grade, and high-frequency consumer electronics applications.

 

Product Details