High-Precision Dispensing and Die Bonding Machine for Power Discrete Devices

 High-Precision Dispensing and Die Bonding Machine for Power Discrete Devices

Product Introduction

HY-GD08 Die Bonder achieves a cycle time of 120 ms with throughput of 28K UPH, delivering X/Y positioning accuracy of ±30 μm and rotation accuracy of ≤ ±3°. The system handles 8" wafers with chip sizes from 0.25 × 0.25 mm to 5 × 5 mm and chip thickness ≥100 μm, accommodating lead frames of 180–300 mm in length, 28–100 mm in width, and 0.1–1 mm in thickness, with magazine sizes up to 310 mm in length and 155 mm in height. Equipped with a 720 × 540 pixel camera offering 256 grayscale levels and recognition accuracy of 1/2 pixel (3.4 μm) over a 16 × 16 mm range, the system features a single swing-arm glue head with mechanical dispensing force of 30–250 g and supports pneumatic or liquid dispensing modes. Operating on 220V / 50Hz with rated power of 1.2 kW and air consumption of 10 L/min (with external vacuum) or 330 L/min (without), the X8 Plus includes automatic glue supply, auto-calibration, frame detection, magazine loading, wafer detection, and 360° wafer rotation, delivering reliable, high-efficiency performance for mid-to-high volume precision assembly using silver epoxy or insulating adhesive processes.

Technical Specifications

Model	X8 Plus	X12 Plus	X8-L	X12-L	E8
Operating System	Windows 7	Windows 7	Windows 7	Windows 7	Windows 7
Cycle Time	120 ms	140 ms	240 ms	240 ms	90 ms
UPH	28K	25K	15K	15K	40K
X/Y Position Accuracy	±30 μm	±30 μm	±25 μm	±25 μm	±30 μm
Rotation Accuracy	≤ ±3°	≤ ±3°	≤ ±2°	≤ ±2°	≤ ±3°
Wafer Size	8"	12"	8"	12"	8"
Chip Size	0.25×0.25 ~ 5×5 mm				0.15~1 mm
Chip Thickness	≥ 100 μm	≥ 100 μm	≥ 100 μm	≥ 100 μm	—
Lead Frame Size	180~300 × 28~100 mm				—
Lead Frame Thickness	0.1~1 mm				—
Magazine Size	190~310 mm				190~290 mm
Magazine Width	32~110 mm				32~95 mm
Magazine Height	100~155 mm				—
Camera Pixels	256 grayscale				—
Image Resolution	720×540 Pixels		1280×1024 Pixels		720×540 Pixels
Recognition Accuracy	1/2 Pixel (3.4 μm)		1/2 Pixel (2.4 μm)		1/2 Pixel (3.4 μm)
Recognition Range	16×16 mm				—
Glue Head	Single head (swing arm)		Linear type		Dual head (swing arm)
Dispensing Force	30–250 g (mechanical)		20–250 g (programmable)		30–250 g (mechanical)
Dispensing Method	Surface dispensing				—
Pump Type	3 types		Dual pump		Dual pump
Dispensing Mode	Pneumatic / Liquid dispensing				Encapsulation
Frame Fixing	Pressure / Vacuum adsorption				—
Automatic Glue Supply	Supported				—
Auto Calibration					Not supported
Frame Detection					—
Loading (Magazine)					—
Wafer Detection					—
Wafer Size	8"	12"	8"	12"	8"
Wafer Frame Size	220×220 mm	320×320 mm	220×220 mm	320×320 mm	230×230 mm
Wafer Expansion	Automatic				Ring type
Wafer Rotation	360°				—
Stroke Range	0–4 mm				—
Needle Adjustment	Electric				Manual
Multi-axis	Supported				—
Power Supply	220V / 50Hz				—
Compressed Air	0.6–1.0 MPa				—
Vacuum	-0.6 ~ -1.0 kPa				—
Rated Power	1.2 kW	1.5 kW	1.0 kW	1.2 kW	1.5 kW
Air Consumption	10 L/min (with external vacuum) / 330 L/min (without vacuum)				10 L/min / 420 L/min

Product Details