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HY-WP08 Wafer Sorting Machine is a wafer sorting system designed for semiconductor packaging processes including wafer grinding, dicing, and material sorting (wafer-to-tray, wafer-to-wafer, tray-to-tray).
Brand :
HYRNUSItem No. :
HY-WP08Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh Speed Automatic Wafer Sorting Machine
Product Introduction
HY-WP08 Die Bonding Machine handles chip sizes from 5 mm to 15 mm (customizable) with placement accuracy of ±30 μm (customizable) and a yield rate of 99.99%. Achieving throughput of ≥3,000 pcs (depending on process/material), the system supports mapping reading and is compatible with 8" and 12" wafer rings (customizable), accommodating trays from 50×50 mm to 140×140 mm. Operating on AC220V / 16A / 3.5 kW with air supply of 0.4–0.8 MPa, the unit weighs 800 kg and offers flexible customization to meet diverse customer requirements.
Key Technical Specifications
| Item | SPA | T8 |
| Operating System | Windows | Windows |
| Placement Accuracy | ±30 μm (customizable) | ±25 μm (customizable) |
| Yield | 99.99% | 99.99% |
| UPH | ≥3000 pcs (depending on process/material) | ≥14000 pcs (depending on process/material) |
| Chip Size | 5 mm–15 mm (customizable) | 0.2 mm–5 mm (customizable) |
| Mapping Reading | Supported | Supported |
| Tray | Suitable for trays (50×50–140×140 mm), customizable | Suitable for trays (50×50–100×100 mm), customizable |
| Wafer Ring | Compatible with 8” / 12” (customizable) | Compatible with 6”/ 8” / 12” (customizable) |
| Power Supply | AC220V / 16A / 3.5 KW | AC220V / 10A / 2.5 KW |
| Air Supply | 0.4–0.8 MPa | 0.4–0.8 MPa |
| Weight | 800 KG | 800 KG |
Product Details
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