High-Precision Die Sort & Placement Machine for LED

 High-Precision Die Sort & Placement Machine for LED

Product Introduction

HY-LD600 Die Bonder supports SMD components of 1212 and larger sizes, delivering a maximum placement speed of 120,000 pcs/h and actual single-machine throughput of ≥90,000 pcs/h, with placement accuracy of ±0.1 mm and a first-pass yield of ≥90%. The system features a customized pick-up head with dual Z-axis, a board size capacity of 350 × 350 mm, and a vibrating plate bulk material feeding mechanism across 2 feeder lanes, eliminating the need for LED component taping and significantly reducing material costs. Equipped with MARK alignment and bottom-side in-flight imaging, the vision system achieves an optimum tact time of 0.045 sec/chip. The machine operates on 220V / 50 Hz with rated power of 2.65 kW, requires air supply pressure of 0.45–0.5 MPa, and has dimensions of 1900 × 1620 × 1800 mm with a weight of 1850 kg. Featuring a user-friendly bilingual interface, flexible production line configuration, and easy maintenance design, the HY-LD600 offers a cost-effective, high-speed, high-precision solution for LED display module manufacturing.

Equipment Features

Supports components of 1212 and larger specifications

Effectively improves the production line quality control first-pass yield to ≥90%

≤ ±0.1 mm

Up to 120,000 Pcs/h

≥ 90,000 Pcs/h

Enables flexible production line setup

User-friendly bilingual (Chinese/English) interface with simple programming

Easy-to-maintain design for simplified upkeep

Technical Specifications

Item	Specification
Pick-up Head	1 Set: Customized for PCB (Dual Z-Axis)
Max. Component Height	10 mm
Board Size (W×D)	350 × 350 mm
Feeder Lanes	2 × Vibrating Plate Bulk Material Feeding Mechanism
Component Supply Configuration	Vibrating Plate Bulk Material Feeding Mechanism
Visual System	MARK Alignment + Bottom-Side In-Flight Imaging
Optimum Tact Time	0.045 sec/Chip
Best CPH (Components Per Hour)	120,000 pcs/H
Equipment Series Connection (Throughput)	≥ 90,000 pcs/Hour (Example: 8 Machines in Line)
Rolled Throughput Yield	≥ 90%
SMD Component Size Range	1212 and Above
Placement Accuracy	±0.1 mm
Power Supply	220 V, 50 Hz
Rated Power	2.65 kW
Air Supply Pressure	0.45–0.5 MPa
Outline Dimension (L × W × H)	1900 × 1620 × 1800 mm
Machine Weight	1850 kg
Noise Level (Average over 5 Minutes)	70 dB
Other	Subject to the actual product

Product Details