High Precision Panel-Level Packaging Die Bonder

HY-PD12 Die Attach Machine achieves a bonding cycle of 250 ms with throughput of 14K UPH, delivering X/Y accuracy of ±25 μm and rotation accuracy of ≤ ±3°. The system handles 12" wafers with chip sizes from 0.2 × 0.2 mm to 3 × 3 mm and chip thickness ≥100 μm, supporting substrate sizes of 340 × 340 mm with thickness of 0.2–4 mm. Equipped with a 1280 × 1024 pixel camera offering recognition accuracy of 2.4 μm, the system features surface pick method with pick force of 30–250 g, bonding travel of 350 × 350 mm, and achieves position accuracy of ±2 μm and repeatability of ±1 μm. Operating on 220V / 50Hz with rated power of 1.0 kW and requiring compressed air of 0.6–1.0 MPa, the HY-PD12 delivers reliable, high-precision performance for heterogeneous integration and high-density interconnection in next-generation electronics manufacturing.

Technical Specifications

Parameter	P8	P12	P8 Pro	P12 Pro	P12 Max
Operating System	Windows 7
Bonding Cycle (ms)	200	250	500		1000
UPH	18k	14k	6-8k		3-5k
X/Y Accuracy (μm)	±25		±15
Rotation Accuracy (°)	≤±3		≤±0.5
Wafer Size	8"	12"	8"	12"	12"
Chip Size (mm)	0.2x0.2~3x3		1x1~6x6
Chip Thickness (μm)	≥100
Substrate Size (mm)	500x200		340x340		685x650
Substrate Thickness (mm)	0.2-4		0.2-2
Image Resolution	1280x1024	2592x1944
Recognition Accuracy	2.4μm	1.2μm
Pick Method	Surface		Surface+Align
Pick Force (g)	30-250		20-250
Bonding Travel (mm)	510x210	350x350		700x660
Position Accuracy (μm)	±2	±1
Repeatability (μm)	±1
Voltage	220V/50Hz
Compressed Air (MPa)	0.6-1.0
Vacuum Input (KPa)	-0.6~-1.0
Power (kW)	0.8	1	1.2	1.35	1.35

Application Scenarios

This panel-level package die bonder is specialized for FOWLP/PLP advanced packaging processes. It is widely used in the die attach of high-performance computing/AI chips, 5G/mm Wave RF devices, SiP/system-in-package solutions, and Mini/Micro LED display panels, enabling heterogeneous integration and high-density interconnection for next-generation electronics.

Product Details