High-Speed Eutectic Die Bonding Machine for Low-Power Devices

HY-TD8 Eutectic Die Bonding Machine is a high-speed eutectic die bonding machine specifically designed for low-power device packaging, supporting SOT23, SOT523, SOT723, SOT923, and SOD123 package types.

Brand :
HYRNUS
Item No. :
HY-TD8
Order(MOQ) :
1 Set
Warranty :
One-Year Warranty and Lifetime Maintenance
Payment :
T/T
Lead Time :
7-35 Days
Product Origin :
China

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High-Speed Eutectic Die Bonding Machine for Low-Power Devices

Product Introduction

HY-TD8 Die Bonder delivers UPH of 18,000+ with a high-speed linear bonding head, high-precision tape feeding, and an ultra-wide track supporting lead frames up to 100 mm. Featuring linear motor drives with 0.5 μm resolution on all axes, it achieves placement accuracy of ±38 μm @ 3σ over a 10 × 100 mm bonding area, handling die sizes from 0.2 × 0.2 mm to 1 × 1 mm with bond force of 30–300 g. Equipped with XK vision system, 8 heating zones, and optional post-bond inspection and tool wear monitoring, the machine operates on 180–240V AC with 3.0 kVA power, measures 1828 × 1219 × 1676 mm, and weighs 800 kg.

Product Advantages

High-precision tape feeding system

Stable high-speed linear bonding head, ideal for eutectic bonding processes

Ultra-wide track design supports up to 100 mm lead frame

UPH up to 18,000+ (L-F ≤ 60 mm, Die size 0.3 mm × 0.3 mm)

Product Performance

Optimized hardware configuration

High-resolution digital camera

Improved optical system design for clearer imaging

Enhanced track structure

Supports lead frame up to 100 mm

Advanced constant temperature control system

No gauge required for tool replacement

Faster nozzle replacement

Simple 3-point alignment

Easy to operate with minimal training

Specifications

Model	HY-TD8
Power Supply	180–240 VAC, Single Phase, 50/60 Hz, 3.0 kVA
Compressed Air	85 L/min, 5.5 bar (clean, dry air)
Machine Size	1828 × 1219 × 1676 mm
Weight	800 kg
X/Y Axis	Linear motor, 0.5 μm resolution
Bonding Area	10 mm (X) × 100 mm (Y)
Z Axis	Linear motor, 0.5 μm resolution, 40 mm stroke
Shielding Gas	0.1 MPa (H₂/N₂ mixture, 5–10% hydrogen)
Die Size	0.2 × 0.2 mm ~ 1 × 1 mm
Vision System	XK Image Recognition System
Vision Modes	Feature Find, Single Point PR with Angle
Magazine Size	115–305 × 20–115 × 50–200 mm
Lead Frame Size	Reel type, width 20–100 mm, thickness 0.1–0.2 mm
Bond Force	30 g ~ 300 g
Placement Accuracy	±38 μm @ 3σ
Heating Zones	8 zones