High‑Speed Die Bonding System for Semiconductor

High‑Speed Die Bonding System for Semiconductor

Product Introduction

HY-DB812 Die Bonder achieves a maximum throughput of 17K UPH with X/Y bonding accuracy of ±25 μm (angle accuracy: <1mm ±3°, ≥1mm ±1°), handling die sizes from 0.20 × 0.20 mm to 10 × 10 mm (thickness ≥75μm) and accommodating 12" wafers with backward compatibility for 6" and 8". The system supports substrates/lead frames from 100–300mm in length and 20–105mm in width, with magazine/stack feeding and linear-type bonding method. Equipped with a 640 × 480 pixel vision system offering 256 grayscale levels and recognition accuracy of 0.25 mil, it features dual dispensing supporting both dot and pattern dispensing, bonding force of 30–550 g, bond head rotation of ±180°, and standard DAF capability with 3-zone temperature control. The system includes comprehensive inspection functions (dispensing accuracy, post-bond inspection, automatic size adjustment), mapping support, data statistics, and SECS communication, with optional barcode scanning and networking. Operating on 220V / 50Hz with power consumption of approx. 1.6 kW and requiring compressed air of ≥0.4 MPa, the HY-DB812 measures 1980 × 1500 × 1600 mm and weighs approximately 1900 kg, delivering reliable, production-validated performance for high-volume batch manufacturing.

Application Scenarios

Suitable for semiconductor packaging applications including IC, QFN/DFN/BGA, power devices (IGBT/SiC), and MEMS sensors.

Feature

Large-size Wafer Compatibility:Supports 6", 8", and 12" wafers, covering mainstream advanced processes and large-size packaging requirements.

High-Speed & High-Precision Motion:Equipped with high-precision linear motor for material handling, high-speed three-axis linear motor die bonding system, and linear motor-driven X/Y positioning stage, ensuring both speed and repeat positioning accuracy to improve throughput and yield.

Dual Dispensing Process:Integrated dual-dispensing system supports dot dispensing / pattern dispensing processes, compatible with various materials such as silver epoxy, solder paste, and conductive adhesive to meet different packaging scenarios.

Intelligent Process Assistance:Features a fully automatic wafer expansion system and intelligent mapping system for wafer expansion, rapid chip defect / position identification, and precise positioning, reducing manual intervention.

Domestic Alternative & Reliability:As a product of a national high-tech enterprise, it has been production-line validated with strong long-term operational stability, fast delivery and service response, making it suitable for batch manufacturing needs.

Technical Specifications

Parameter	Specification
Loading Method	Magazine / Stack feeding
Die Bonding Method	Linear type
Die Size	0.20mm × 0.20mm ~ 10mm × 10mm (thickness ≥75μm)
Substrate / Leadframe Size	Length: 100-300mm, Width: 20-105mm, Thickness: 0.1-1mm (or L:160-300mm × W:25-100mm)
Die Bonding Accuracy	X/Y: ±25 μm; Angle: <1mm ±3°, ≥1mm ±1°
UPH	Max. 17K (varies depending on die size, leadframe density, etc.)
Wafer Size	12 inch (compatible with 6/8 inch)
Bond Head Rotation Angle	±180° (or 0~360°)
Wafer Rotation Angle	0°~360°
Die Bonding Force	30~550 g
Dispensing Method	Dual dispensing
Pattern Dispensing	Supported
DAF (Die Attach Film)	Standard (3-zone temperature)
Inspection Functions	Dispensing, dot accuracy, position automatic adjustment, automatic dispensing size adjustment, post-bond inspection, etc.
Vision System	Grayscale: 256 levels; Resolution: 640×480 pixels; Recognition accuracy: 0.25 mil
Mapping Function	Supported
Data Functions	Data statistics & data recording supported
SECS Communication	Supported
Barcode Scanning & Networking	Optional (available upon customer request)
Power Supply	220V / 50Hz, Power: approx. 1.6 kW
Compressed Air	≥0.4 MPa
Dimensions (L×W×H)	1980 × 1500 × 1600 mm
Weight	Approx. 1900 kg

Process

Software Functions

Dispensing, die picking, and die placing all utilize color cameras to enhance recognition compatibility and contrast, eliminating recognition difficulties caused by color variations on the chip surface.

Product Details