LINE- Fully Automatic CLIP Bonding Line for Efficient and Reliable Power Devices

Die Attach Equipment Driven by cutting-edge technological advancements in die bonding and clip bonding, combined with a vacuum reflow soldering system, the fully automatic CLIP bonding linedelivers industry-leading quality and reduced user costs.

The Die Bonder offers high placement accuracy and is suitable for chips of various sizes and thicknesses.

The Clip Bonder achieves high-precision placement control for clip arrays ranging from very small to large sizes, as well as the number of clips transferred per cycle. The vacuum reflow oven consistently reduces the total void area to well below 3%.

Product Advantages

DieBonder HY-DB12	Dual dispensing system supports high output
	Fully programmable synchronous Z-motion of ejector and bond head
	Control of ultra-thin chips during high-speed movement
	Precise control of pick & place Z-height using displacement sensor
	Dispensing and pick & place functions including chip inspection and image capture
ClipBonder HY-CB800	Dual dispensing system supports mixed clip layouts
	High-precision bond head rotation
	Real-time monitoring of pick and placement force
	Large field of view observation
	Upward vision system detects missing clips
	Design and supply of stamping dies provided
	Dispensing and clip bonding functions include clip inspection
Vaccum Reflow Oven	Application void rate < 3%
	Low oxygen environment in the furnace chamber, industry-leading low gas consumption
	Exhaust gas treatment system
	Real-time process data monitoring and collection (temperature, pressure, gas flow, etc.)
	Multi-stage vacuum configuration
	Dual vacuum chamber available as an option
	Independent operation available upon request

Specifications

Parameter	Die Bond (XK-HY-DB12-C)	Clip Bond
Accuracy
- Die/Clip Placement	±20–25 μm @3σ	±38 μm @3σ
- Die/Clip Rotation	±1° @3σ	±3° @3σ
Pick/Place Force	20 g – 300 g	50 g – 1000 g
Max Frame Size	300 mm (L) × 105 mm (W)	300 mm (L) × 105 mm (W)
Die/Clip Size	0.5 mm – 12 mm	0.25 mm – 10 mm
Die/Clip Thickness	50 μm – 750 μm	0.1 mm – 0.4 mm
Wafer Size / Tape Width	6", 8", 12" (standard)	6 mm – 40 mm, 60 mm (optional)
Cycle Time / UPH	180 ms / 20,000 pcs/h	1500 ms / 2,400 pcs/h

Vaccum Reflow Oven Parameter

Max Frame Size	300 mm × 105 mm
Minimum Vacuum Level	< 3 Torr
Max Operating Temperature	420°C
Heating Zones	10 independently controlled zones + 1 cooling zone
Oxygen Level	< 100 ppm (inside furnace / outside vacuum chamber)
	< 50 ppm (inside vacuum chamber)
Protective Gas	Nitrogen
	Forming gas (6% H₂ + N₂)
Gas Consumption	< 50 L/min
Exhaust Gas Treatment	High-efficiency ionization and condensation filter tank collectionFlux

Terms of Use

Temperature:Below 28°C

Humidity:30% – 70%

Cleanroom:Class 10,000 or better

Voltage:220V for all equipment except the vacuum reflow oven (380V)

Product Details