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HY-DM2003 Die Bonding Microscope Stand is designed to provide stable microscope support for semiconductor die attach, bonding, and inspection processes. Its adjustable positioning allows operators to clearly observe chips and working areas, improving operational accuracy and convenience.
Brand :
HYRNUSItem No. :
HY-DM2003Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSemiconductor Packaging Die Bonding Microscope Stand
Product Introduction
HY-DM2003 Die Bonding Microscope Stand is designed for precision observation during semiconductor die attach, bonding, chip positioning, and inspection processes. It provides stable support for the microscope and allows flexible adjustment of the viewing height, angle, and working position according to different operating requirements.
The stand helps operators clearly observe small chips, bonding locations, and processing details while maintaining sufficient working space around the equipment. Its stable structure and user-friendly adjustment design improve positioning accuracy, operational comfort, and process efficiency. It is suitable for use with manual and semi-automatic die bonding equipment, wire bonders, and other semiconductor packaging workstations.
Configuration
| No. | Item | Qty. | Specification |
| 1 | Dual-magnification Microscope | 1 set | 20× / 40× |
| 2 | Large Acrylic Base Plate | 1 pc | 390 × 335 × 10 mm |
| 3 | Die Bonding Work Stage | 1 pc | 260 × 190 × 10 mm (for 6-inch inner ring) |
| 4 | Ring Light Source | 1 set | — |
Product Details
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