High Speed Silver Epoxy Die Bonder for General ICs

HY-SSD12 Die Attach Equipment delivers a throughput of 20,000 UPH with XY placement accuracy of ±20 μm @ 3σ and die rotation accuracy of ±0.2° @ 3σ (for die >1×1 mm) or ±1° @ 3σ (for die <1×1 mm). The system handles die sizes from 0.25 × 0.25 mm to 14 × 14 mm and supports wafers up to 12 inches, accommodating frames of 100–300 mm in length, 15–100 mm in width, and 0.1–0.8 mm in thickness, with magazine sizes of 110–310 mm in length, 20–110 mm in tape width, and 70–153 mm in height. Equipped with an excellent dispensing control system and a multi-gray pattern recognition system achieving position accuracy of ±1/4 pixel, the bond head features programmable force of 30–300 g. Operating on 220V AC single-phase 50/60 Hz with power consumption of 3000 W and requiring compressed air of 6 bar at 500 L/min flow rate, the HY-SSD12 measures 2,288 × 1,395 × 1,840 mm and weighs 1,860 kg.

Specifications

System Capability	UPH	20,000
	XY Placement Accuracy	±20 μm @ 3σ
	Die Rotation (Die size >1×1 mm)	± 0.2° @ 3 σ
	Die Rotation (Die size <1×1 mm)	±  1°@ 3 σ
	Die Size (Standard)	0.25×0.25 ~ 14×14 mm²
	Frame Size - Length	100 – 300 mm
	Frame Size - Width	15 – 100 mm
	Frame Size - Thickness	0.1 – 0.8 mm
	Magazine Size - Length	110 – 310 mm
	Magazine Size - Tape Width	20 – 110 mm
	Magazine Size - Height	70 – 153 mm
Bond Head System	Bond Head Force	30–300 g (programmable)
Wafer System	Wafer Size	12–8 inches
Pattern Recognition System	PR System	Multi-gray PRS
	Position Accuracy	±1/4 pixel
Facility Requirements	Voltage	220 VAC (single phase)
	Frequency	50/60 Hz
	Min. Air Pressure	6 bar (87 PSI)
	Flow Rate	500 LPM @ 6 bar
	Power Consumption	3000 W
Dimensions & Weight	W × D × H	2,288 × 1,395 × 1,840 mm³
	Net Weight	1,860 kg

Terms of Use

Temperature:Below 28°C

Humidity:30% – 70%

Cleanroom:Class 10,000 or better

Voltage:220V for all equipment except the vacuum reflow oven (380V)

Product Details