Fully Automatic Multi-Head Soft Solder Die Bonder for Multi-Chip Power Device

HY-MSD08/SD12 Die Bonder delivers productivity of 3.0–5k UPH (MSD08) or 6.0–8k UPH (SD12), with XY placement accuracy of ±70 μm (MSD08) or ±50 μm (SD12) and soft solder void rate of 2% (single space) to 8.5% (total chip area). It handles die sizes from 0.5 × 0.5 mm to 14 × 14 mm and supports substrates up to 105 mm in width (SD12), with thickness of 0.1–1 mm, and features ultra-thin chip handling capability down to 50 μm. Key advantages include increased productivity, shortened process cycle, improved reliability and yield, a self-developed precision bond head with LVDT function, direct-drive ejector, track hidden heating system with TMCS, ultra-low oxygen content control, map function support, and multiple wafer ring configurations. Machine dimensions are 1,295 × 2,530 × 1,765 mm with a weight of approximately 2,000 kg. 

Equipment Feature

Increased productivity

Shortened process cycle

Effectively improved product reliability

Effectively improved product performance and yield

Self-developed precision bond head with LVDT function

Direct-drive ejector, ultra-thin chip handling

Track hidden heating system with TMCS

Track ultra-low oxygen content control

Optional composite loading method

Map function supported

Multiple wafer ring configurations

Dot-write lock method supported

Specifications

Parameter	HY-MSD08	HY-SD12
Productivity	3.0–5k* (spot soldering, pressure welding + single row lead frame)	6.0–8k* (dual soldering + matrix lead frame PDFN-10R)
Solder Thickness	1 mil – 3 mil	1 mil – 3 mil
Die Tilt	≤2 mil (chip size ≤150×150 mil)	≤2 mil (chip size ≤150×150 mil)
Soft Solder Void	2% (single space) – 8.5% (total chip area)	2% (single space) – 8.5% (total chip area)
Soft Solder Coverage	100%	100%
XY Placement Accuracy	±2.7 mil (70 μm), ±2°	±1.9 mil (50 μm), ±2°
Track Width	70 mm	105 mm
Bond Head Configuration	Standard bond head	High-performance bond head
Material Handling Capability
Die Size	0.5×0.5 – 14×14 mm	0.5×0.5 – 14×14 mm
Substrate Size		Ultra-thin chip handling capability down to 50 μm (optional)
Length	115 – 310 mm	115 – 310 mm
Width	12 – 70 mm	12 – 105 mm
Thickness	0.1 – 1 mm	0.1 – 1 mm
Magazine Size
Length	115 – 310 mm	115 – 310 mm
Width	16 – 120 mm	16 – 120 mm
Height	68 – 160 mm	68 – 160 mm
Machine Dimensions & Weight
W × L × H	1,295 × 2,530 × 1,765 mm³	1,295 × 2,530 × 1,765 mm³
Weight	Approx. 2,000 kg	Approx. 2,000 kg

Terms of Use

Temperature:Below 28°C

Humidity:30% – 70%

Cleanroom:Class 10,000 or better

Voltage:220V for all equipment except the vacuum reflow oven (380V)

Soft Solder Display

Product Details