High Performance Soft Solder Die Bonder for Single-Row Lead Frames TO Package

HY-SD8012 Die Bonder Equipment equiped all motion systems adopt a direct drive design, ensuring precision and speed while maintaining high-quality control. The series offers three models: HY-SD8012 (3–5k UPH, 70mm track width, ±70 μm accuracy, suitable for single-row lead frames like TO263/TO220/TO247/TO3P), HY-SD8012PLUS (5–7k UPH, supports dual solder writing for multi-row frames like TO252-4/TOLL-4/PDFN/SOP-8), and HY-SD8012PLUS+ (6–9k UPH, 105mm track width with high-performance bond head for TO252-6/8/TOLL/PDFN-12/IPM). All models handle die sizes from 0.5 × 0.5 mm to 14 × 14 mm with soft solder void rate of 2% (single space) to 5% (total chip area), 100% solder coverage, and die tilt ≤2 mil. Key features include precise temperature control, self-developed precision bond head, direct-drive ejector for ultra-thin chip handling, track hidden heating system with TMCS, ultra-low oxygen content control, map function support, and multi-machine connection capability. Machine dimensions are 1,900 × 1,200 × 1,700 mm with weight of approximately 1,600 kg.

Equipment Feature

High UPH with direct drive control system

Precise temperature control system

Self-developed precision bond head

Direct-drive ejector, ultra-thin chip handling

Track hidden heating system with TMCS

Track ultra-low oxygen content control

Optional composite loading method

Multi-machine connection solution for same model

Excellent solder coverage

Map function supported

Multiple wafer ring configurations

Dot-write lock method supported

Specifications

Parameter	HY-SD8012	HY-SD8012PLUS	HY-SD8012PLUS+
Productivity	3–5k* (spot soldering, pressure welding + single row lead frame)	5–7k* (dual soldering + matrix lead frame PDFN-10R)	6–9k* (dual soldering + matrix lead frame PDFN-10R)
Solder Thickness	1–3 mil	1–3 mil	1–3 mil
Die Tilt	≤2 mil (chip size ≤150×150 mil)	≤2 mil (chip size ≤150×150 mil)	≤2 mil (chip size ≤150×150 mil)
Soft Solder Void	2% (single space) & 5% (total chip area)	2% (single space) & 5% (total chip area)	2% (single space) & 5% (total chip area)
Soft Solder Coverage	100%	100%	100%
XY Placement Accuracy	±2.7 mil (70 μm), ±2°	±1.9 mil (50 μm), ±2°	±1.9 mil (50 μm), ±2°
Track Width	70 mm	70 mm	105 mm
Bond Head Configuration	Standard bond head	Standard bond head	High-performance bond head
Material Handling Capability
Die Size	0.5×0.5 – 14×14 mm	0.5×0.5 – 14×14 mm	0.5×0.5 – 14×14 mm
Substrate Size
Length	110–300 mm	110–300 mm	110–300 mm
Width	12–70 mm	12–70 mm	12–105 mm
Thickness	0.1–1 mm	0.1–1 mm	0.1–1 mm
Magazine Size
Length	115–310 mm	115–310 mm	115–310 mm
Width	16–120 mm	16–120 mm	16–120 mm
Height	68–160 mm	68–160 mm	68–160 mm
Machine Dimensions & Weight
W × D × H	1,900 × 1,200 × 1,700 mm	1,900 × 1,200 × 1,700 mm	1,900 × 1,200 × 1,700 mm
Weight	Approx. 1,600 kg	Approx. 1,600 kg	Approx. 1,600 kg

Application

Model	Main Application	Features	Max Track Width
HY-SD8012	Single-row lead frame packaging (e.g., TO263, TO220, TO247, TO3P, etc.)	Supports dispensing / writing / pressing solder functions	70 mm
HY-SD8012PLUS	Multi-row lead frame packaging (e.g., TO252-4, TOLL-4, PDFN, SOP-8, etc.)	Supports dual solder writing function	70 mm
HY-SD8012PLUS+	Multi-row lead frame packaging (e.g., TO252-6/8, TOLL, PDFN-12, IPM, etc.)	Supports dual solder writing function; equipped with high-performance bond head	105 mm

Terms of Use

Temperature:Below 28°C

Humidity:30% – 70%

Cleanroom:Class 10,000 or better

Voltage:220V for all equipment except the vacuum reflow oven (380V)

Product Details