bonder machine

The HY-DA300 Multi-chip Die Attach Machine  is specifically designed for multi-chip fully automatic placement processes in the packaging of electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing. 

The HY-WB800 Fully Automatic Deep Access Wire Bonder is designed for internal chip interconnection in advanced electronic packaging. It is widely used in hybrid circuits, MCM, MEMS, RF, microwave, optoelectronic, and automotive modules. It features real-time bonding and ultrasonic monitoring, precise loop control, EFO system, and high-stability wire feed for reliable high-end applications.

The HY-WB400/HY-WB400P Wire Bonding Machine is a tilting and rotatable workholder wire bonding system designed for multi-planar interconnection in optical communication device packaging. It features automatic material handling, customizable fixtures, programmable optical path, and a high-precision XYZR direct drive system. With fast changeover and PR Look Ahead, it delivers high UPH and efficient production performance.

HY-HW300 Full-Automatic Heavy Wire Bonder is designed for chip interconnection in advanced electronic components, widely used in power modules for EVs, renewable energy, rail transit, medical and aerospace systems. It features real-time bonding deformation and ultrasonic energy monitoring, closed-loop loop control, non-destructive testing, and high-precision automatic calibration for stable and reliable performance.

HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.

HY-SSD12 Die Bonder is a fully automatic high-speed silver epoxy die bonder that integrates ultra-high speed with high precision, designed for general ICs and discrete devices. 

HY-TD8 Eutectic Die Bonding Machine is a high-speed eutectic die bonding machine specifically designed for low-power device packaging, supporting SOT23, SOT523, SOT723, SOT923, and SOD123 package types.

HY-DB812 Die Attach Equipment is a high-speed die bonding system designed for medium-to-high precision semiconductor packaging, supporting IC, QFN/DFN/BGA, power devices (IGBT/SiC), and MEMS sensors.

 HY-GD08 Die Bonding Machine is a high-precision dispensing and die bonding system designed for power discrete devices, consumer ICs, and sensor production, supporting SOP, SOT, SOD, DFN, QFN, and DIP package types. 

HY-LD600 Die Sort & Placement Machine is a dedicated pick-and-place machine for LED display screens. It is designed for mass production of fine-pitch LED display modules, featuring low equipment procurement cost, high speed, high precision, and significant cost savings for customers by eliminating the need for LED component taping.

HY-DP200 Die Bonder is a high-speed, high-precision die bonding system engineered for ultra-thin and advanced semiconductor packaging applications, supporting IC, LSI, BGA, CSP, QFN, NAND Flash, Mobile DRAM, eMMC, SiP, and small-die devices.