Plasma Cleaning Equipment

HY-EB03H 2.5L tabletop ICP treatment unit is compact lab plasma surface treatment equipment with 13.56MHz RF power and dual gas channels. It generates high-density ICP plasma for cleaning, activating, etching and bonding materials, and is widely used for PDMS microfluidics, photoresist ashing and semiconductor lab research.  

This industrial vacuum plasma cleaner adopts 13.56MHz RF power and PLC touch control. Equipped with military-grade sealed chamber, dual plasma modes and dual adjustable gas channels, it stores up to 100 process recipes and delivers uniform plasma treatment.

HY-EL25H is a laboratory plasma treatment system widely adopted by research institutes, corporate R&D departments and small-batch pilot production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a square stainless steel vacuum chamber, plasma generator, vacuum pump and gas inlet & exhaust ports. It effectively enhances substrate surface adhesion and improves surface hydrophilicity, with extensive applications in material bonding, coating, substrate film deposition and wafer bonding. This equipment delivers stable, repeatable plasma treatment for semiconductor, microfluidic and new material research projects.

HY-PS13 is a CCP vacuum plasma system dedicated to wafer photoresist stripping, cleaning and surface activation. Popular in research labs and small-batch semiconductor production, its stainless steel chamber full set with pump & gas modules improves material surface adhesion and hydrophilicity for bonding, coating and thin-film processes.

HY-ES10 is an experimental plasma treatment system, widely adopted by research institutes, universities, corporate R&D labs and low-volume production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a vacuum chamber, plasma generator, vacuum pump, and gas inlet & exhaust ports. The treatment chamber is fabricated from square stainless steel.

HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.

HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.

HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.

HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.

HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.

HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.

HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.