Products

HY-EB03H 2.5L tabletop ICP treatment unit is compact lab plasma surface treatment equipment with 13.56MHz RF power and dual gas channels. It generates high-density ICP plasma for cleaning, activating, etching and bonding materials, and is widely used for PDMS microfluidics, photoresist ashing and semiconductor lab research.  

The HY-WB800 Fully Automatic Deep Access Wire Bonder is designed for internal chip interconnection in advanced electronic packaging. It is widely used in hybrid circuits, MCM, MEMS, RF, microwave, optoelectronic, and automotive modules. It features real-time bonding and ultrasonic monitoring, precise loop control, EFO system, and high-stability wire feed for reliable high-end applications.

The HY-WB400/HY-WB400P Wire Bonding Machine is a tilting and rotatable workholder wire bonding system designed for multi-planar interconnection in optical communication device packaging. It features automatic material handling, customizable fixtures, programmable optical path, and a high-precision XYZR direct drive system. With fast changeover and PR Look Ahead, it delivers high UPH and efficient production performance.

This industrial vacuum plasma cleaner adopts 13.56MHz RF power and PLC touch control. Equipped with military-grade sealed chamber, dual plasma modes and dual adjustable gas channels, it stores up to 100 process recipes and delivers uniform plasma treatment.

The HY-WB700/HY-WB700P Fully Automatic Ball Wire Bonder is a standard planar wire bonding system designed for high-precision semiconductor packaging applications. It supports customizable rails, fixtures, and magazines. Equipped with dual-frequency transducer, auto-focus optical path, advanced motion control, and multi-stage EFO system, it ensures stable, efficient, and highly reliable bonding performance.

HY-HW300 Full-Automatic Heavy Wire Bonder is designed for chip interconnection in advanced electronic components, widely used in power modules for EVs, renewable energy, rail transit, medical and aerospace systems. It features real-time bonding deformation and ultrasonic energy monitoring, closed-loop loop control, non-destructive testing, and high-precision automatic calibration for stable and reliable performance.

HY-EL25H is a laboratory plasma treatment system widely adopted by research institutes, corporate R&D departments and small-batch pilot production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a square stainless steel vacuum chamber, plasma generator, vacuum pump and gas inlet & exhaust ports. It effectively enhances substrate surface adhesion and improves surface hydrophilicity, with extensive applications in material bonding, coating, substrate film deposition and wafer bonding. This equipment delivers stable, repeatable plasma treatment for semiconductor, microfluidic and new material research projects.

HY-PS13 is a CCP vacuum plasma system dedicated to wafer photoresist stripping, cleaning and surface activation. Popular in research labs and small-batch semiconductor production, its stainless steel chamber full set with pump & gas modules improves material surface adhesion and hydrophilicity for bonding, coating and thin-film processes.

HY-ES10 is an experimental plasma treatment system, widely adopted by research institutes, universities, corporate R&D labs and low-volume production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a vacuum chamber, plasma generator, vacuum pump, and gas inlet & exhaust ports. The treatment chamber is fabricated from square stainless steel.

HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.

HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.

HY-UTB600 is a high-precision automatic ultrasonic welding equipment specially developed for power semiconductors, copper substrates, terminal wiring harnesses and busbars. It is widely applied in the welding process of metal terminals for power modules, copper lead frames and other electronic components. Featuring full automatic inline production capacity, it delivers outstanding performance in welding precision, production efficiency and low maintenance cost.